Analytical tool for electro-thermal modelling of microbolometers

Zając, Piotr; Maj, Cezary; Szermer, Michal; Lobur, Mykhaylo; Napieralski, A.

doi:10.1109/eurosime.2014.6813826

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A Materials Properties1

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2015

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“…Although there are many materials commonly used in microbolometer fabrication -Titanium (Ti) [9], Vanadium Oxide (VO) [10], Yttrium barium copper oxide (YBaCuO, YBCO) [11], GeSiO [12], poly SiGe [13], BiLaSrMnO and others -the most attractive among them are semiconductor (amorphous silicon Į-Si, poly-Si, Si-Ge) [4], because they have a higher temperature coefficient of resistance (TCR) than other materials.…”

Section: A Materials Propertiesmentioning

confidence: 99%

A study on microbolometer electro-thermal circuit modelling

Nazdrowicz

Szermer

Maj

et al. 2015

2015 22nd International Conference Mixed Design of Integrated Circuits &Amp; Systems (MIXDES)

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Electro-thermal models are commonly used in simulations and designing MEMS devices, also in case of microbolometers. These models allow to estimate sensors performance before fabrication that consequently impacts on fabrication cost. Coupling of electric and thermal domains and building appropriate model for carrying out simulations are crucial to detect all phenomena having impact for Readout Integrated Circuit. This article brings closer to the subject matter of circuit modelling (willingly implemented in MATLAB/SIMULINK or PSPICE tools) and to its theoretical background.

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