Analyzing Conductance of Mixed Carbon-Nanotube Bundles for Interconnect Applications

Haruehanroengra, S.; Wang, Wei

doi:10.1109/led.2007.901584

Cited by 91 publications

(34 citation statements)

References 20 publications

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“…In [28], the impact of the nanotube diameter on the contact and ohmic resistance has been studied by using a simple model based on experimental data. In [29], a diameterdependent model of the nanotube conductance, based on the approach given in [25], has been proposed. In [30], a multichannel approach based on the electron waveguide model given in [20] has been proposed, but the number of conducting channels is a parameter depending on the CNT radius that is external to the model, and it is approximated through a formula given in [25] for zigzag CNTs.…”

Section: Introductionmentioning

confidence: 99%

Signal Propagation in Carbon Nanotubes of Arbitrary Chirality

Miano

Forestiere

Maffucci

et al. 2011

IEEE Trans. Nanotechnology

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In carbon nanotubes (CNTs) with large radii, either metallic or semiconducting, several subbands contribute to the electrical conduction, while in metallic nonarmchair nanotubes with small radii the wall curvature induces a large energy gap. In this paper, we propose a model for the signal propagation along single wall CNTs (SWCNTs) of arbitrary chirality, at microwave through terahertz frequencies, which takes into account both these characteristics in a self-consistent way. We first study an SWCNT, disregarding the wall curvature, in the frame of a semiclassical treatment based on the Boltzmann equation in the momentum-independent relaxation time approximation. It allows expressing the longitudinal dynamic conductivity in terms of the number of effective conducting channels. Next, we study the behavior of this number as the nanotube radius varies and its relation with the kinetic inductance and quantum capacitance. Furthermore, we show that the effects of the spatial dispersion are negligible in the collision dominated regimes, whereas they may be important in the collisionless regimes, giving rise to sound waves propagating with the Fermi velocity. Then, we study the effects on the electron transport of the terahertz quantum transition induced by the wall curvature by using a quantum kinetic approach. The nanotube curvature modifies the kinetic inductance and gives arise to an additional RLC branch in the equivalent circuit, related to the terahertz quantum transition. The proposed model can be used effectively for analyzing the signal propagation in complex structures composed of SWCNTs with different chirality, such as bundles of SWCNTs and multiwall CNTs, providing that the tunneling between adjacent shells may be disregarded

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Section: Introductionmentioning

confidence: 99%

Signal Propagation in Carbon Nanotubes of Arbitrary Chirality

Miano

Forestiere

Maffucci

et al. 2011

IEEE Trans. Nanotechnology

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“…Researchers have developed RLC circuit models for various CNT interconnect alternatives and compared their performance with Cu interconnects. RLC circuit models have been developed for individual SWCNTs 67),74), 75) , SWCNT bundles 12),77) and MWCNTs 77), 78) . Other studies have presented some interesting discussions on the impact of process variations on CNT performance 79) and the possibility of CNTs replacing Cu interconnects in future FPGA fabrics 80) .…”

Section: On-chip Cnt Interconnect Researchmentioning

confidence: 99%

Trends in Emerging On-Chip Interconnect Technologies

Pasricha

Dutt

2008

IPSJ Transactions on System LSI Design Methodology

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In deep submicron (DSM) VLSI technologies, it is becoming increasingly harder for a copper based electrical interconnect fabric to satisfy the multiple design requirements of delay, power, bandwidth, and delay uncertainty. This is because electrical interconnects are becoming increasingly susceptible to parasitic resistance and capacitance with shrinking process technology and rising clock frequencies, which poses serious challenges for interconnect delay, power dissipation and reliability. On-chip communication architectures such as buses and networks-on-chip (NoC) that are used to enable inter-component communication in multi-processor systems-on-chip (MPSoC) designs rely on these electrical interconnects at the physical level, and are consequently faced with the entire gamut of challenges and drawbacks that plague copper-based electrical interconnects. To overcome the limitations of traditional copper-based electrical interconnects, several research efforts have begun looking at novel interconnect alternatives, such as on-chip optical interconnects, wireless interconnects and carbon nanotube-based interconnects. This paper presents an overview and current state of research for these three promising interconnect technologies. We also discuss the existing challenges for each of these technologies that remain to be resolved before they can be adopted as replacements for copper-based electrical interconnects in the future.

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“…It is necessary to remember that the level of electrostatic screening inversely determines the electrostatic field and Coulomb potential of the ions in the nanotubes. For semiconducting nanotubes, the band gap is reduced thanks to the increase of size of valence and conduction bands generated by the Stark effect derived of the applied electrical field to the nanotubes (Haruehanroengra & Wang, 2007). Arrays of carbon nanotubes have electrical properties which can be controlled by means of its length, diameter, and chirality (Jain et al, 2011).…”

Section: Introductionmentioning

confidence: 99%