Anchoring modified polystyrene to boron nitride nanosheets as highly thermal conductive composites for heat dissipation

Han, Weifang; Xiaohan, Chu; Li, Yongwei; Xu, Zhijiang; Li, Wei; Fu, Peizhen; Zhang, Xinwei; Jia, Zhengfeng; Zhang, Xiangdong

doi:10.1002/pc.26502

Cited by 13 publications

(9 citation statements)

References 54 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Currently, hexagonal boron nitride (BN), similar to graphene, has gained widespread attention as an extremely promising family of ceramics. 20 As an effective additive, BN has been applied to the thermal management of insulation systems because of its high resistivity ($ 10 18 Ω.cm) and superior intrinsic TC (300-2000 W /mÁK). 21,22 Additionally, BN-based units with impressive corrosion resistance and appealing oxidation resistance are expected to replace metals and carbon materials for harsh conditions (such as high temperatures, strong acids, and alkaline environments).…”

Section: Introductionmentioning

confidence: 99%

Growth of polyaniline nanowire arrays on boron nitride microrods enables high‐efficient thermal transport

Han,

Liu,

Zhou

et al. 2024

Polymer Composites

View full text Add to dashboard Cite

The rapid development of flexible conductive materials has promoted the research on conductive polymer (CP)‐based materials. However, CPs have relatively low thermal conductivity (TC), which can result in severe heat dissipation problems for device applications. In this work, core–sheath structured polyaniline@boron nitride (BN@PANI) composites were prepared by in‐situ growth strategy, in which PANI nanowire arrays were uniformly anchored to the surface of BN microrods. Thanks to the particular structure, the as‐prepared BN@PANI composite shows excellent thermal management capabilities. Specifically, the TC of the BN@PANI composite is 4.32 W/m·K at low BN loading of 10 wt%, which is almost 17.8 times that of pure PANI. Moreover, the excellent heat dissipation performance is intuitively presented through infrared imaging technology. Impressively, the PANI nanowire arrays are vertically arranged on the BN surface to form a conductive pathway, which results in conductivity comparable to pure PANI. This work broadens the ideas for preparing high‐performance CP‐based composites by using insulating fillers.Highlights Core–sheath structured BN@PANI composites were prepared by an in‐situ growth strategy. The thermal conductivity of composite was 4.32 W/m·K at 10 wt% BN loading. The introduction of BN had little effect on the conductivity of PANI. The BN@PANI composites possessed excellent thermal management capability. This work contributes to understanding heat transport in conductive polymers.

show abstract

Section: Introductionmentioning

confidence: 99%

Growth of polyaniline nanowire arrays on boron nitride microrods enables high‐efficient thermal transport

Han,

Liu,

Zhou

et al. 2024

Polymer Composites

View full text Add to dashboard Cite

show abstract

“…Polymer materials have been used widely in the field of many industries to provide mechanical, , thermal management, , acoustic, , optical, and electronic − performances as well as protection and connection functions, , etc. Epoxy resin, as an engineering polymer material, possesses many excellent properties such as low dielectric constants, low dielectric loss, high Young’ modulus, and high thermal resistance as well as electronic insulation; therefore, it is an excellent engineering material for microelectronic industries.…”

Section: Introductionmentioning

confidence: 99%

Curing Kinetics and Mechanical Properties of Epoxy–Cyanate Ester Composite Films for Microelectronic Applications

Ding,

Fang,

et al. 2023

ACS Omega

View full text Add to dashboard Cite

In general, although abundant literature studies are available on epoxy resin systems, a complete description of the curing kinetics in epoxy–cyanate ester composites relevant to the microelectronics industry is still lacking. Herein, curing behaviors of Ajinomoto build-up films, which are epoxy/silica composites, were studied by the non-isothermal differential scanning calorimetry method, and then, three non-isothermal curing kinetics models and model-free curing methods were used to analyze curing behaviors. In addition, a copper layer was also deposited onto the surface of the build-up film, and its interfacial adhesion property was also analyzed at different pre-curing conditions. The results showed that the curing reaction of the build-up film contains two curing reaction processes, and the first curing process is suited for the autocatalytic curing model, while the other curing process is suited for the Kamal curing kinetics model. Three model-free curing methods were used to calculate the activating energy at different degrees of curing, which indicated that the activating energy is variable during the whole curing process. The interfacial adhesion strength between the build-up film and copper layer decreased with the increase in the degree of curing, which is attributed to the contribution of mechanical anchoring. This work will offer guidance in curing behaviors for improving interfacial bonding force and controlling warpage behavior for chip substrates in the future.

show abstract

“…Some researchers have modified the filler surface to improve the compatibility between the filler and the matrix in order to increase the thermal conductivity of the composite 21,22 . Some researchers have modified the fillers with dimensionality and the core‐shell structure to achieve the expected properties of the composites 23–26 . Yet, the filler design is often very challenging, with high costs and low yields, making it impossible to achieve large‐scale applications.…”

Section: Introductionmentioning

confidence: 99%

“…21,22 Some researchers have modified the fillers with dimensionality and the core-shell structure to achieve the expected properties of the composites. [23][24][25][26] Yet, the filler design is often very challenging, with high costs and low yields, making it impossible to achieve large-scale applications.…”

mentioning

confidence: 99%

High thermal conductivity electrical insulation composite EP/h‐BN obtained by DC electric field induction

Liang,

Feng,

Yang

et al. 2023

Polymer Composites

View full text Add to dashboard Cite

Epoxy resin, as an adhesive for the main insulation system of large generators, has excellent insulation properties. But its poor thermal conductivity limits the capacity enhancement of large generators. Forming thermally conductive pathways by using electric field to induce high thermal conductivity fillers in the polymer can effectively improve the thermal conductivity of the composite at low loading condition. In this article, a DC electric field is used in epoxy resin (EP) to induce two‐dimensional inorganic fillers h‐BN deflection and head‐to‐tail lap, which can make the heat flow transfer along the in‐plane of the particles and contribute to the more efficient thermal conductivity network. A high thermal conductivity of 0.544 W/(m K) was achieved at a low load of 10 wt%, which has an improvement of 289% compared to pure EP (0.14 W/[m K]) and 130% compared to the randomly dispersed composite with the same load. The composites have excellent thermal conductivity as well as insulating properties, among which volume resistivity is 1.46 × 1012 Ω/cm, increasing by 61.4% compared to pure EP. This method is easy to be carried out in engineering and has great possibilities for the main insulation of large generators and even for other applications with high thermal conductivity electrical insulation.Highlights The structure of composites was adjusted by direct current electric field. The high in‐plane thermal conductivity of h‐BN is fully exploited. The relationship between deflection angle of BN and thermal conductivity of composites was built.

show abstract

Anchoring modified polystyrene to boron nitride nanosheets as highly thermal conductive composites for heat dissipation

Cited by 13 publications

References 54 publications

Growth of polyaniline nanowire arrays on boron nitride microrods enables high‐efficient thermal transport

Growth of polyaniline nanowire arrays on boron nitride microrods enables high‐efficient thermal transport

Curing Kinetics and Mechanical Properties of Epoxy–Cyanate Ester Composite Films for Microelectronic Applications

High thermal conductivity electrical insulation composite EP/h‐BN obtained by DC electric field induction

Contact Info

Product

Resources

About