1999
DOI: 10.1016/s0040-6090(98)01001-3
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Angular distribution of sputtered atoms in physical vapor deposition and collimated sputtering

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Cited by 5 publications
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“…Then, the deposition process was carried out by dc-magnetron sputtering: in our apparatus it is possible to move the substrate holder so that it is in front of the target source of the material to be grown, so as to have a flux of atoms that is perpendicular to the substrate. Moreover, the apparatus allows the rotation of the substrate guarantying a uniform thickness of the sample and it is equipped with a collimator with a 2:1 (height:width) aspect ratio to reduce the angular spread of the incident sputtered atoms 29 (in this way, it is about 10 degrees). We have verified that the use of 6 such a collimator greatly favors the lift-off process and offsets the shadow effect, which may alter the dot thickness at the border.…”
Section: Methodsmentioning
confidence: 99%
“…Then, the deposition process was carried out by dc-magnetron sputtering: in our apparatus it is possible to move the substrate holder so that it is in front of the target source of the material to be grown, so as to have a flux of atoms that is perpendicular to the substrate. Moreover, the apparatus allows the rotation of the substrate guarantying a uniform thickness of the sample and it is equipped with a collimator with a 2:1 (height:width) aspect ratio to reduce the angular spread of the incident sputtered atoms 29 (in this way, it is about 10 degrees). We have verified that the use of 6 such a collimator greatly favors the lift-off process and offsets the shadow effect, which may alter the dot thickness at the border.…”
Section: Methodsmentioning
confidence: 99%