Anion Adsorption Induced Reversal of Coherency Strain

Trimble, T. M.; Tang, Lei; Vasiljević, Nataša; Dimitrov, Nikolay; Schilfgaarde, Mark van; Friesen, Cody; Thompson, Carl V.; Seel, Steven C.; Floro, J. A.; Sieradzki, Karl

doi:10.1103/physrevlett.95.166106

Cited by 27 publications

(53 citation statements)

References 23 publications

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“…0.062 ML] characterized by discommensuration lines reminiscent of the (22× √ 3) reconstruction, albeit more disordered [1]. Such surface corrugation was previously observed experimentally [28,29] and was attributed to areas of accumulated stress in computational studies [30,31].…”

Section: Resultssupporting

confidence: 56%

Structure and Reactivity of Cu-doped Au(111) Surfaces

Grillo

Megginson

Christie

et al. 2018

e-J. Surf. Sci. Nanotech.

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The structure and surface chemistry of ultrathin metallic films of one metal on another are strongly influenced by factors such as lattice mismatch and the formation of near-surface alloys. New morphologies may result with modified chemical properties which in turn open up different routes for molecular adsorption, desorption and surface functionalization, with important consequences in several fields of application.The Cu/Au(111) system has received the attention of many studies, only a few however have been performed in ultra-high vacuum (UHV), using surface sensitive techniques. In this contribution, the room temperature deposition of copper onto the (22× √ 3)-Au(111) surface, from submonolayer to thick film, is investigated using scanning tunnelling microscopy (STM).The onset of copper adsorption is seen to occur preferentially at alternate herringbone elbows, with a preference for hcp sites. With increasing coverage, copper-rich islands exhibit a reconstructed surface reminiscent of the clean Au(111) herringbone reconstruction. Disordered, pseudo-ordered and ordered surface layers are observed upon annealing. Models for the initial adsorption/incorporation mechanism, formation of adlayers and evolution with increasing coverage and annealing are qualitatively discussed. Further, the reactivity of copper-doped Au (111) systems is considered towards the adsorption of organic molecules of interest in nanotechnology and in catalytic applications.

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Section: Resultssupporting

confidence: 56%

Structure and Reactivity of Cu-doped Au(111) Surfaces

Grillo

Megginson

Christie

et al. 2018

e-J. Surf. Sci. Nanotech.

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“…The surface stress difference, F, associated with geometrically strained overlayer growth can be given by 25,31 …”

Section: Discussionmentioning

confidence: 99%

In Situ Stress Measurements during Cobalt Electrodeposition on (111)-Textured Au

Fayette

Bertocci

Stafford

2016

J. Electrochem. Soc.

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Cantilever curvature was used to examine stress generation during the electrodeposition of Co onto (111)-textured Au from 0.1 mol/L NaClO 4 + 0.001 mol/L Co(ClO 4 ) 2 (pH = 4.8) in films measuring less than 25 nm in thickness and at Co current efficiencies ranging from 65% to 90%. XRD analysis indicates that the Co is face-centered cubic and maintains the (111) texture of the Au substrate, suggesting epitaxial but not pseudomorphic growth on the Au. The stress-thickness product showed a −0.2 N/m compression in the first monolayer followed by increasing tensile stress as the film thickened. The initial compressive stress is most likely due to surface and interface stresses that dominate at submonolayer coverage. Steady state tensile stress, ranging from 0 to +450 MPa, developed in continuous Co films and showed a strong dependence on electrode potential. However, over this potential range there is no change in grain size or growth rate, factors typically associated with tensile stress. We attribute the tensile stress and its potential dependence to the formation of hydrogen stabilized vacancies, defects found to be quite stable in fcc Fe-group metals and alloys deposited under conditions of H + discharge. The use of electrodeposited Co-based materials has attracted much attention over the past several decades owing in part to their interesting magnetic 1-3 and catalytic properties. [4][5][6][7][8][9][10][11] These properties are largely dependent upon the structure and morphology of the electrodeposit, which in the case of cobalt can vary dramatically with overpotential, electrolyte pH, and the presence of strongly adsorbing anions. 2,[12][13][14][15][16]

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“…However, owing to the complexity of transitions behind this unique voltammetric picture, the distinct structural examination at characteristic potentials has never been straightforward. As a result, a fair share of controversy still accompanies discussions on that matter [2,5,17,19]. For instance, whereas the low-density honeycomb structure has been exhaustively described and characterized, until recently [5] there were no reports of direct STM imaging of the Cu atoms anticipated by the X-ray work of Toney et al [17].…”

Section: Introductionmentioning

confidence: 97%

“…The summary of both ex situ and in situ analytical and structural studies on Cu/Au(1 1 1) can be found in a recent review by Herrero et al [1]. Almost all newly developed or adapted in situ structure-sensitive techniques in electrochemistry were introduced by or employed in studies of this system [2][3][4][5][6][7][8][9]. The wealth of results related to the behavior and structural characteristics renders the Cu upd layer on Au(1 1 1) in sulfate solution an excellent candidate for theoretical modeling.…”

Section: Introductionmentioning

confidence: 98%

“…As a result, a fair share of controversy still accompanies discussions on that matter [2,5,17,19]. For instance, whereas the low-density honeycomb structure has been exhaustively described and characterized, until recently [5] there were no reports of direct STM imaging of the Cu atoms anticipated by the X-ray work of Toney et al [17]. Also, it is not yet clear if the pseudomorphic Cu monolayer on Au(1 1 1) is covered by an ordered layer of sulfate ions as in the case of a bulk Cu(1 1 1) surface [20] or only a physically adsorbed and disordered sulfate adlayer.…”

Section: Introductionmentioning

confidence: 98%

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