Anion effects on the interfacial alloying in successively electrodeposited Cu and Au ultrathin films

Halide-Dependent Dealloying of Cux/Auy Core/Shell Nanoparticles for Composition Analysis by Anodic Stripping Voltammetry

“…24,25 This general core/shell structure does not necessarily prevent CuAu alloying at the Au/Cu interface, which likely occurs to some extent based on previous thin film work. 65 Composition-Dependent ASV in Cl − Electrolyte. Figure 3A shows ASVs versus Ag/AgCl obtained in acidic KCl solution of Cu 1 /Au x core/shell NPs for x values ranging from 0 to 0.1.…”

“…[17][18][19]63 Alternatively, the Au can form an alloy with the interior Cu core as opposed to forming an intermetallic outer shell. 65 It is likely that there are some Au alloying with the interior Cu core and some Au forming an intermetallic outer shell, especially considering the different ASVs for Cu/Au core/shell synthesis and CuAu mixed alloy synthesis (Figure 2).…”

Stability and reactivity analysis of single metal and bimetallic nanostructures by anodic stripping voltammetry.

“…68 The fact that there was not a significant oxidation peak before this peak (only a very small one at ~0.2 V) indicates that the Au formed a mostly closed, passivating shell over the Cu core, preventing oxidation of the Cu. This positive shift of Cu oxidation peak is due to the direct contract of Cu with Au, which has been reported recently by Dimitrov group 251 and others. 284 The peak at 0.9 V therefore includes the oxidation of both Au and Cu simultaneously.…”

“…It is likely that it is more positive after exchange due to the interaction with Au, which has been observed previously by us 203 and others. 204,251 The ASV in KBr electrolyte shows one oxidation peak for Au at 0.65 V, which is consistent with Au NPs, but the Ep is about 200 mV positive from the Ep of 0.45 V for the original 1.6 nm diameter Au NPs. This increased Ep is either due to the first ASV scan in H2SO4, which leads to a particle size increase, or due to a a size change in the Au NPs during exchange with Ag + .…”

Highly Active and Durable CuxAu(1–x) Ultrathin-Film Catalysts for Nitrate Electroreduction Synthesized by Surface-Limited Redox Replacement

“…This phenomenon is possibly due to enhanced homogeneity in the Cu–Au alloy layer deposited by SLRR through layer-by-layer deposition. A more detailed consideration and further analysis of data presented in Table along with accounting for the number of administered SLRR cycles and the charge density of one ML of Pb, which is same on both Cu and Au polycrystalline electrodes, could be used to estimate quantitatively the atomic fraction of Cu/Au ratio in the SLRR-deposited alloys. More specifically, such an estimate could be done knowing that 15 SLRR cycles will produce on a one-at-a-time basis, a total of 15 MLs of Pb UPD with a total charge of 4500 μC cm –2 (300 μC cm –2 for 1 ML Pb on Au poly ). , Then, Pb will further be replaced at OCP by Cu 2+ and AuCl 4 – at an assumed efficiency of 94% as suggested by earlier experience with the growth of pure Cu by SLRR .…”