1987
DOI: 10.1016/0022-0248(87)90091-1
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Anisotropic lateral growth in GaAs MOCVD layers on (001) substrates

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Cited by 189 publications
(75 citation statements)
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“…Since the [011] step is initially fully kinked, the arsenic desorption leads to a smaller number of kink sites at this step for group III growth species. At the [011] steps the concentration of incorporation sites for group III species, and therefore the lateral growth rate of GaAs, at small misorientations is hardly influenced by the arsenic partial pressure [5]. However, at larger misorientations especially the straight [011] step will become much rougher as discussed above.…”
Section: Arsenic Coveragementioning
confidence: 96%
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“…Since the [011] step is initially fully kinked, the arsenic desorption leads to a smaller number of kink sites at this step for group III growth species. At the [011] steps the concentration of incorporation sites for group III species, and therefore the lateral growth rate of GaAs, at small misorientations is hardly influenced by the arsenic partial pressure [5]. However, at larger misorientations especially the straight [011] step will become much rougher as discussed above.…”
Section: Arsenic Coveragementioning
confidence: 96%
“…Due to this reconstruction the steps in the [011] and the [017] directions on the (100) surface show a different behaviour [5,27]. The step in the [011] direction, or A-step, is more undulated than the B-step in the [011] direction [28].…”
Section: Kink Densitymentioning
confidence: 99%
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“…These peaks instead form concurrently with large faceted hillocks on the InGaAs(110) surface. Facetdependent incorporation rates have been observed for a number of materials including GaAs, 118,119 InGaN, 120 and InGaAsP. 99,100 For the latter two materials, different incorporation rates of each atomic species produce orientationdependent alloy compositions.…”
Section: Ingaas(110): Photoluminescencementioning
confidence: 99%
“…This incorporation probability of Ga is related to the density of the dangling bonds at the step edge, and the dangling bond density is related to the availability of As at the step edge. 7 Hence, low As coverage is the key factor to ensure that the migrating Ga atoms are not incorporated into steps and kinks at the corners and thereby preventing lateral overgrowth.…”
mentioning
confidence: 99%