Anisotropic thermal conductivity and electromagnetic interference shielding of epoxy nanocomposites based on magnetic driving reduced graphene oxide@Fe3O4
“…However, any researchers in this area should benchmark thermal performance of their new concepts with the current commercially available TIMs. [152][153][154][155][156][157][158][159][160][161][162][163][164][165][166] Research should also focus on minimizing the overall thermal resistance instead of just focusing on increasing thermal conductivity. This is because although λ TIM increases with increasing volume fraction, bulk thermal resistance reaches a minimum due to competing effects between the BLT and λ TIM .…”
In recent years, miniaturization and integration have become the development trends of electronic devices. With the power of electronic devices continuing to increase, the amount of heat generated is sharply increasing. Thermal interface material (TIM) can effectively improve heat transfer between two solid interfaces, and it plays an important role in the performance, service life and stability of electronic devices. In this case, higher requirements are put forward for thermal management, so much attention is also attached to the innovation and optimization of TIM. In this paper, recent research development of TIM is reviewed. Rheology-based modeling and design are discussed for the widely used polymeric TIMs. It is discussed for the effects of thermal conductive fillers on the properties of composites. Many studies have shown that some polymers filled with high thermal conductivity and low loss ceramics are well suitable for electronic packaging for device encapsulation. Until now, extensive attentions have been paid to the preparation of polymeric composites with high thermal conductivity for the application in electronic packaging. Finally, the problems are also discussed and the research directions of TIM in the future are prospected.
“…However, any researchers in this area should benchmark thermal performance of their new concepts with the current commercially available TIMs. [152][153][154][155][156][157][158][159][160][161][162][163][164][165][166] Research should also focus on minimizing the overall thermal resistance instead of just focusing on increasing thermal conductivity. This is because although λ TIM increases with increasing volume fraction, bulk thermal resistance reaches a minimum due to competing effects between the BLT and λ TIM .…”
In recent years, miniaturization and integration have become the development trends of electronic devices. With the power of electronic devices continuing to increase, the amount of heat generated is sharply increasing. Thermal interface material (TIM) can effectively improve heat transfer between two solid interfaces, and it plays an important role in the performance, service life and stability of electronic devices. In this case, higher requirements are put forward for thermal management, so much attention is also attached to the innovation and optimization of TIM. In this paper, recent research development of TIM is reviewed. Rheology-based modeling and design are discussed for the widely used polymeric TIMs. It is discussed for the effects of thermal conductive fillers on the properties of composites. Many studies have shown that some polymers filled with high thermal conductivity and low loss ceramics are well suitable for electronic packaging for device encapsulation. Until now, extensive attentions have been paid to the preparation of polymeric composites with high thermal conductivity for the application in electronic packaging. Finally, the problems are also discussed and the research directions of TIM in the future are prospected.
“…On the other hand, higher loadings beyond 0.3 vol.% slightly decreased the thermal stability which can be attributed to the non-homogeneous dispersion of the filler particles. Heat-resistance index (T HRI ) which is a measure of thermal stability has been calculated using equation (6) 54,55 Figure 6.TGA (a) and (b) DTG curves of Epoxy/rGO nanocomposites.…”
Epoxy/conducting filler nanocomposites with high dielectric performance have emanated as a promising material in electronic and electrical industry. In this work, a facile and low-cost method, that is, thermal reduction at 400°C was adopted for the preparation of reduced graphene oxide (rGO) from graphene oxide (GO). The rGO was characterized by X-ray diffraction analysis, Fourier transform infrared spectroscopy, Raman spectroscopy, Field emission scanning electron microscopy and Transmission electron microscopy. Epoxy nanocomposite presented a dielectric permittivity of 35 at 1.8 vol.% loading of rGO (Ep/G-1.8) at 103 Hz, which was 5 times higher than neat epoxy and with a low dielectric loss. With the addition of 0.3 vol.% of rGO (Ep/G-0.3), the mechanical properties such as tensile strength, Young’s modulus and impact strength were enhanced by 34%, 56% and 54%, respectively. Dynamic mechanical analysis (DMA) revealed that in comparison to epoxy, there was a tremendous enhancement of storage modulus (55%) and the glass transition temperature (Tg) exhibited a remarkable shift of 39°C towards higher temperature for Ep/G-0.3. Cross-link density and coefficient of effectiveness (C-factor) estimated from the storage modulus improved significantlyfor Ep/G-0.3. Theoretical modelling was done on the viscoelastic properties of the composites. SEM studies indicated the uniform dispersion of rGO throughout in the epoxy matrix. Thermogravimetric analysis revealed that inclusion of rGO improved the thermal stability of epoxy nanocomposites.
“…The authors produced a free-standing graphene/MXene film, demonstrating excellent thermal conductivity and heat dissipation for fire retardant ability. This composite film was produced from graphene oxide (GO), synthesized by modified Hummer's method [194], and Ti 3 C 2 T x , prepared by selective etching of T i3 AlC 2 in HCl + LiF mixture. The vacuum-assisted filtration with a cellulose ester filter membrane was used to synthesize graphen oxide/Ti 3 C 2 T x film.…”
A new class of two-dimensional nanomaterials, MXenes, which are carbides/nitrides/carbonitrides of transition and refractory metals, has been critically analyzed. Since the synthesis of the first family member in 2011 by Yury Gogotsi and colleagues, MXenes have quickly become attractive for a variety of research fields due to their exceptional properties. Despite the fact that this new family of 2D materials was discovered only about ten years ago, the number of scientific publications related to MXene almost doubles every year. Thus, in 2021 alone, more than 2000 papers are expected to be published, which indicates the relevance and prospects of MXenes. The current paper critically analyzes the structural features, properties, and methods of synthesis of MXenes based on recent available research data. We demonstrate the recent trends of MXene applications in various fields, such as environmental pollution removal and water desalination, energy storage and harvesting, quantum dots, sensors, electrodes, and optical devices. We focus on the most important medical applications: photo-thermal cancer therapy, diagnostics, and antibacterial treatment. The first results on obtaining and studying the structure of high-entropy MXenes are also presented.
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