2022
DOI: 10.1016/j.ceramint.2022.03.030
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Anisotropically enhancing thermal conductivity of epoxy composite with a low filler load by an AlN/C fiber skeleton

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Cited by 14 publications
(7 citation statements)
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“…With the strong demand of lightweight, multi-functional and low-cost in various fields, carbon fiber epoxy resin matrix composites are generally applied in aerospace and other fields due to their virtue of high specific strength, good stability and so on. [1][2][3] They are usually applied in engineering structural materials in the form of composite laminates. However, the low thermal conductivity and the poor interlayer fracture toughness of epoxy matrix composites are prone to making the performance of the composites aged in service under high temperature conditions and delaminated by external force.…”
Section: Introductionmentioning
confidence: 99%
“…With the strong demand of lightweight, multi-functional and low-cost in various fields, carbon fiber epoxy resin matrix composites are generally applied in aerospace and other fields due to their virtue of high specific strength, good stability and so on. [1][2][3] They are usually applied in engineering structural materials in the form of composite laminates. However, the low thermal conductivity and the poor interlayer fracture toughness of epoxy matrix composites are prone to making the performance of the composites aged in service under high temperature conditions and delaminated by external force.…”
Section: Introductionmentioning
confidence: 99%
“…One effective approach to enhancing the thermal conductivity of biodegradable polymers is incorporating high thermal/ conductive fillers through melt blending. 12 Commonly used thermal fillers include silicon carbide (SiC), 13,14 aluminum oxide (Al 2 O 3 ), 15 aluminum nitride (AlN), 16 and boron nitride (BN). 17−19 Nevertheless, high filler loadings can negatively impact mechanical properties and impose processing difficulties.…”
Section: ■ Introductionmentioning
confidence: 99%
“…8,9 Though the metal and carbon materials can significantly enhance the TC of polymers, they also induce high electrical conductivity, which is not applicable under insulating field. 10 The ceramic particles, including alumina (Al 2 O 3 ), 11,12 silicon carbide (SiC), 13,14 aluminum nitride (AlN), 15,16 and boron nitride (BN), 17,18 have been widely used as filler in the preparation of thermally conductive composites owing to their relative high TC and outstanding insulation characteristics. 19,20 Among them, particular attention is paid to two-dimensional (2D) BN that possesses a specific structure with high TC (180 W/(mK)), high aspect ratio, and high resistivity, resistance to chemical solvent, strong antioxidative properties, and high electrical breakdown strength (794 kV/mm).…”
Section: Introductionmentioning
confidence: 99%