Annealing and recrystallization kinetics of ultrathin gold wires: Modulus and resistivity measurements

Busch, Kenneth A.; Künzi, H.U.; Ilschner, Bernhard

doi:10.1016/0036-9748(88)90013-0

Cited by 14 publications

(7 citation statements)

References 7 publications

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“…The elastic modulus of Captek was determined to be 39 MPa, which is less than that of Type I gold alloys used for inlays 29 and also that of 99% pure gold. 30 A possible explanation for this might be incomplete infiltration of gold (Captek G) into the porous network rendered after the Captek P material is fired, resulting in an internal microstructure with voids or pores. As discussed previously, a porous network has been noted in other noncast metal-ceramic restorations, 5 although it was not reported in the study on Captek mentioned earlier.…”

Section: Discussionmentioning

confidence: 99%

Metal‐Ceramic Interface Evaluation of a Gold‐Infiltrated Alloy

Vasani

Kawashima

Ziebert

et al. 2009

Journal of Prosthodontics

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Microscopy and XRD analysis showed that micromechanical interlocking is the primary mechanism of porcelain adherence to Captek metal. The use of Capbond prior to porcelain application to Captek results in gold nodules on the surface to aid retention. Existing metal-ceramic bond compatibility standardized tests are not sufficient for evaluating Captek, primarily due to the flexibility of the material.

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Section: Discussionmentioning

confidence: 99%

Metal‐Ceramic Interface Evaluation of a Gold‐Infiltrated Alloy

Vasani

Kawashima

Ziebert

et al. 2009

Journal of Prosthodontics

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“…[17][18][19][20] Microstructure, texture, and mechanical properties of gold wires were reported during annealing. [21][22][23][24] Due to the strong elastic anisotropy in gold (E Ͻ111Ͼ /E Ͻ100Ͼ ϭ 115 GPa/42 GPa), the change in elastic modulus was used to detect texture change during recrystallization. Recently, Cho et al reported recrystallization and grain growth of gold bonding wire during isothermal annealing at 300 °C and 400°C using electron backscatter diffraction (EBSD).…”

Section: Introductionmentioning

confidence: 99%

Recrystallization and grain growth of cold-rolled gold sheet

Cho

2005

Metall Mater Trans A

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Recrystallization and grain growth of a cold-rolled gold sheet with 98 pct reduction in area (RA) were investigated with electron backscatter diffraction (EBSD) and X-ray diffraction (XRD). Gold with some dopants (Be, Ca, and La) was used in this research and its recrystallization temperature was 320 °C. Isothermal annealing experiments at 400 °C, 500 °C, and 600 °C were carried out for the cold-rolled gold sheet, and recrystallization texture was examined. In the cold-rolled gold sheet, ␣-and ␤-fibers were measured mainly and some shear texture components were found on the surface. Shear texture components remained on the surface for 2 hours at 400 °C and were consumed by other recrystallized grains after 24 hours at 400 °C. Microstructure and texture evolution during in-situ annealing at 400 °C were investigated from the cold-rolled state to the fully recrystallized state using EBSD. Most of the newly, recrystallized grains came from the deformed ␤-fiber regions and consisted of ␤-fiber, cube, and other random orientations.

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“…[4,5] Recrystallization, recovery and grain growth all occur during annealing, and they affect the microstructures, microtextures and mechanical properties of gold wires. [6][7][8][9] The evolution of textures during wire drawing has been investigated by many researchers. The wire drawing textures of fcc metals typically have ͗111͘ and ͗100͘ fiber texture components.…”

Section: Introductionmentioning

confidence: 99%

Recrystallization and grain growth of cold-drawn gold bonding wire

Cho

Kim

et al. 2003

Metall Mater Trans A

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Recrystallization and grain growth of gold bonding wire have been investigated with electron backscatter diffraction (EBSD). The bonding wires were wire-drawn to an equivalent strain greater than 11.4 with final diameter between 25 and 30 mm. Annealing treatments were carried out in a salt bath at 300 °C, and 400 °C for 1, 10, 60 minutes, and 1 day. The textures of the drawn gold wires contain major ͗111͘, minor ͗100͘, and small fractions of complex fiber components. The ͗100͘ oriented regions are located in the center and surface of the wire, and the complex fiber components are located near the surface. The ͗111͘ oriented regions occur throughout the wire. Maps of the local Taylor factor can be used to distinguish the ͗111͘ and ͗100͘ regions. The ͗111͘ oriented grains have large Taylor factors and might be expected to have higher stored energy as a result of plastic deformation compared to the ͗100͘ regions. Both ͗111͘ and ͗100͘ grains grow during annealing. In particular, ͗100͘ grains in the surface and the center part grow into the ͗111͘ regions at 300 °C and 400°C. Large misorientations (angles Ͼ40 deg) are present between the ͗111͘ and ͗100͘ regions, which means that the boundaries between them are likely to have high mobility. Grain average misorientation (GAM) is greater in the ͗111͘ than in the ͗100͘ regions. It appears that the stored energy, as indicated by geometrically necessary dislocation content in the subgrain structure, is larger in the ͗111͘ than in the ͗100͘ regions.

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Annealing and recrystallization kinetics of ultrathin gold wires: Modulus and resistivity measurements

Cited by 14 publications

References 7 publications

Metal‐Ceramic Interface Evaluation of a Gold‐Infiltrated Alloy

Metal‐Ceramic Interface Evaluation of a Gold‐Infiltrated Alloy

Recrystallization and grain growth of cold-rolled gold sheet

Recrystallization and grain growth of cold-drawn gold bonding wire

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