Anode current on gold in mixed thiosulfate-sulfite electrolytes

Zelinsky, A.G.

doi:10.1016/j.electacta.2014.12.097

Cited by 28 publications

(16 citation statements)

References 29 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…SO 3 2− reduction to dithionite, S 2 O 4 2− , is possible at negative potential while its subsequent oxidation to SO 3 2− , dithionate, S 2 O 6 2− , or SO 4 2− may account for the net oxidative reaction at the positive potential limit. [77][78][79][80][81] Formation of S 2 O 4 2− and its subsequent decomposition may also yield thiosulfate, S 2 O 3 2− , and/or sulfide, S 2− , that perturbs the SO 3 2− adsorption waves. Further work will be required to clarify the chemistry involved although the same processes that develop during slow sweep rate voltammetry in the neat Na 2 SO 3 may contribute the various voltammetric peaks evident during extended voltammetic cycling of Au in the Na 2 SO 3 -NaAu(SO 3 ) 2 electrolyte (Fig.…”

Section: Electrochemical Measurementsmentioning

confidence: 99%

Morphological Transitions during Au Electrodeposition: From Porous Films to Compact Films and Nanowires

Josell

Levin

Moffat

2015

J. Electrochem. Soc.

View full text Add to dashboard Cite

Gold electrodeposition was studied in a sulfite electrolyte to which micromolar concentrations of Tl 2 SO 4 were added. Hysteresis and a regime of negative differential resistance (NDR) evident in electroanalytical measurements are correlated with deposit morphology and interpreted through measurements of thallium underpotential deposition (upd). Deposit morphologies range from specular surfaces to highly faceted dendrite-like grains of moderate aspect ratio and, for potentials within the NDR region, sub-50 nm diameter, high aspect ratio 110 oriented single crystal nanowires. The nanowires exhibit an epitaxial relationship to the substrate that permits one step fabrication of surfaces densely covered with high aspect ratio nanowires having controlled orientations. The NDR and nanowires are a consequence of the non-monotonic relationship between Tl coverage and growth velocity; at low coverage Tl accelerates Au deposition while at higher coverage it inhibits deposition. Immiscibility of the Tl and Au supports on-going surface segregation during area expansion that accompanies nanowire growth leading to greater dilution of the additive coverage and more rapid growth at the nanowire tips, while the sidewalls remain passivated by a saturated Tl coverage. Interest in nanostructures is driven by the unique properties associated with high surface area to volume materials that express quantum or mesoscale phenomena of importance to diverse subjects ranging from biology and medicine 1-3 to optics and energy conversion. [4][5][6][7] Of particular interest is the substantial literature on solution or vapor processing to yield a wide variety of nanostructures including high aspect ratio nanowires. 4,8,9 Solution-based, chemical reduction processes are attractive because they are inexpensive and scalable.9-18 Subsequent processing involving particle packing and/or substrate interactions can lead to higher order organization and colloidal crystals.19 Alternatively, nanostructures can be grown on or in surfaces that have been shaped by lithography or other means to obtain control of orientation and/or placement.8 Electrochemical processing may involve throughmask plating in patterned templates 20,21 or superconformal electrodeposition of metals and alloys [22][23][24][25][26][27][28][29][30][31] including gold 32-34 in high aspect ratio features. However, these processes require nanoscale patterned topography to create such structures and the associated patterning often comes with increased processing complexity.Controlled anisotropic growth and orientation, if not position, is possible through vapor-liquid-solid (VLS) growth processes. Fabrication of semiconductor and oxide nanowires typically uses dewetting of a low melting point metal catalyst where the resulting clusters set the feature size while epitaxy to the underlying substrate can control the growth orientation. 5,[35][36][37] More recently, an electrochemical electrolyte-liquid-solid analog has been demonstrated for growth of Ge nanowires. [38][39][40] In another ap...

show abstract

Section: Electrochemical Measurementsmentioning

confidence: 99%

Morphological Transitions during Au Electrodeposition: From Porous Films to Compact Films and Nanowires

Josell

Levin

Moffat

2015

J. Electrochem. Soc.

View full text Add to dashboard Cite

show abstract

“…The baths containing both sulfite and Na 2 S 2 O 3 as the complexing agents have been reported to be more stable [22,[24][25][26], thus the thiosulfate-sulfite mixed-ligand bath has been investigated in depth [27,28]. Green and Roy [22] have discussed the speciation of gold plating solutions that contain Na 2 SO 3 and Na 2 S 2 O 3 as the complexing agents.…”

Section: Introductionmentioning

confidence: 97%

Acceleration effect of Na2S2O3 on the immersion gold plating on Ni-P surface from a sulfite based electrolyte

Gong

et al. 2016

Surface and Coatings Technology

View full text Add to dashboard Cite

“…Thiosulfate is a more promising lixiviant for gold recovery compared to cyanide. Thiosulfate leaching of gold in copper–ammonia systems, as shown in Equation , has attracted extensive researchers since its initial discovery . In this process, the Cu(II) not only reacts with gold but also participates the oxidation of thiosulfate, as shown in Equation .…”

Section: Introductionmentioning

confidence: 99%

Effect of tetrathionate on thiosulfate leaching of gold in copper–ammonia system

Shi

Nie

et al. 2018

Asia-Pacific J Chem Eng

View full text Add to dashboard Cite

Gold thiosulfate leaching have the best prospects for industrial application; however, the effect of polythionate on this system is complicated. Effect of tetrathionate on thiosulfate leaching of gold in a copper–ammonia system over a prolonged period of time was studied in detail. The results show that the gold concentration is higher in the tetrathionate‐added solution at the end of experiment. Scanning electron microscope and surface‐enhanced Raman spectroscopy were utilized to study the passive layer on gold surface. The results show that the blue material adsorbed on gold surface in tetrathionate system is copper hydroxide species. Besides that, the UV‐visible spectrophotometer absorbance peak of Cu(II) complex in tetrathionate‐added solution locates at higher wavelength.

show abstract

Anode current on gold in mixed thiosulfate-sulfite electrolytes

Cited by 28 publications

References 29 publications

Morphological Transitions during Au Electrodeposition: From Porous Films to Compact Films and Nanowires

Morphological Transitions during Au Electrodeposition: From Porous Films to Compact Films and Nanowires

Acceleration effect of Na2S2O3 on the immersion gold plating on Ni-P surface from a sulfite based electrolyte

Effect of tetrathionate on thiosulfate leaching of gold in copper–ammonia system

Contact Info

Product

Resources

About