Anodic bonding for monolithically integrated MEMS

Schjølberg-Henriksen, Kari; Jensen, Geir Uri; Hanneborg, A.; Jakobsen, Henrik

doi:10.1016/j.sna.2003.11.003

Cited by 11 publications

(9 citation statements)

References 26 publications

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“…72 All of these new lithiumcontaining glasses have been reported to have successfully bonded to silicon at y200uC in the presence of a suitable electric field. [69][70][71][72] The effects of sodium contamination during anodic bonding have recently been addressed by Schjølberg-Henriksen et al 73,74 in the context of monolithically integrated MEMS in which the relevant electronics for the device to operate sit together with the device on a single chip. Using metal-oxide semiconductor (MOS) capacitors as test structures, they have demonstrated that sodium contamination can occur during anodic bonding, but that its effect can be minimised to an acceptable level by the application of a 100 nm thick protective plasma-enhanced chemical-vapour-deposited silicon nitride layer protecting the electronics.…”

Section: Glasses As Cathode Materialsmentioning

confidence: 99%

Anodic bonding

Knowles¹,

Helvoort²

2006

International Materials Reviews

117

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Originally developed in the late 1960s, anodic bonding, also known as electrostatic bonding, field-assisted bonding or Mallory bonding, has become one of the most important silicon packaging techniques. Despite its industrial relevance the bonding mechanism is mainly only qualitatively understood and is almost solely applied to the bonding of silicon to Pyrex glass. The objective of the present paper is to review the current state of knowledge of the anodic bonding process. Possible material combinations and current scientific and industrial applications of this bonding technique are reviewed. The various aspects of the bonding process, such as the creation of intimate contact, the cation movement in the glass and the interfacial chemical reactions, are discussed in detail and related to the external current measured during bonding to describe the bonding process quantitatively. A better understanding of the process itself should help not only to improve the process control and the quality of devices, but also to broaden the application of this successful bonding technique to more challenging designs, to smaller device sizes and to systems other than silicon-Pyrex glass.

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Section: Glasses As Cathode Materialsmentioning

confidence: 99%

Anodic bonding

Knowles¹,

Helvoort²

2006

International Materials Reviews

117

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“…Therefore, an anodic bonding process using silicon bulk micromachining or RIE process used in PDMS fabrication technique using O 2 plasma are not necessary. Accordingly, it is expected that the production cost can be decreased because fabrication costs of PCR chamber is decreased 13,14 .…”

Section: Original Researchmentioning

confidence: 99%

Fabrications of a continuous-flow DNA amplifier using dry film resist

et al. 2010

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The fabrication technique of DFR using micro channels can form hundreds micro thickness channels with only a photo-lithography process without any etching. Also, DFR is confirmed low consumption power because DFR has very lower thermal conductivity (2.33 W/mK) in comparison with silicon (168 W/mK) therefore displays high performance in heating an internal sample. As DFR is hydrophilic, it can bond with glasses without any treatment. Therefore, anodic bonding process using silicon bulk micromachining or an RIE process used in the PDMS fabrication technique using O 2 plasma is not necessary. According to these advantages, it is expected that production cost can be decreased because fabrication costs of the PCR chamber is decreased. In this paper, a soda-lime glass substrate coated with a DFR of the fluid to cycle through different temperature zones was used to form a micro-channel structure and integrated Pt heater continuous-flow PCR.

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“…14,15 Traditionally, anodic bonding is widely used in the production of numerous Micro-electromechanical systems (MEMS), such as electronics and semiconductor packaging industry. 16,17 Anodic bonding method belongs to the vacuum chamber method. Compared to the traditional vacuum chamber method, anodic bonding method has a dramatic influence on bonding performance.…”

Section: Introductionmentioning

confidence: 99%

“…Anodic bonding technique has several advantages, for instance low bonding temperature, quick response, and good sealing performance . Traditionally, anodic bonding is widely used in the production of numerous Micro‐electromechanical systems (MEMS), such as electronics and semiconductor packaging industry . Anodic bonding method belongs to the vacuum chamber method.…”

Section: Introductionmentioning

confidence: 99%

Enhanced vacuum glazing bonding strength by anodic bonding‐assisted sealing method

Chen

Zhang

et al. 2019

Int J of Appl Glass Sci

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A novel sealing method of vacuum glazing is introduced in this study. Anodic bonding technology was used to enhance the bonding strength of the sealant of vacuum glazing. Two sheets of plane glass were sealed by V2O5‐P2O5‐TeO2 glass powder with low glass transition temperature (339.3℃) using anodic bonding‐assisted low‐temperature sintering. Through analyzing the results of Shear Strength test, the diagram of microstructures of the sealing bond taken by a micro Super‐depth Microscopy, Scanning Electron Microscope (SEM), and Energy Dispersive Spectrometer (EDS), the best bonding treatment schedule was determined for achieving the strongest bond. The experiment results show that anodic bonding has a dramatic influence on bonding performance. When the sealing temperature and bonding time are kept constant, the shear strength of the sample increases by increasing the bonding voltage. With the bonding temperature of 470℃ and the voltage of 600 V, the air tightness of the sealed sample is 3.9 × 10−9 Pa·m3/s. The improved bonding strength can enhance life‐time of vacuum glazing.

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Anodic bonding for monolithically integrated MEMS

Cited by 11 publications

References 26 publications

Anodic bonding

Anodic bonding

Fabrications of a continuous-flow DNA amplifier using dry film resist

Enhanced vacuum glazing bonding strength by anodic bonding‐assisted sealing method

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