2010
DOI: 10.1007/s13206-010-4303-9
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Fabrications of a continuous-flow DNA amplifier using dry film resist

Abstract: The fabrication technique of DFR using micro channels can form hundreds micro thickness channels with only a photo-lithography process without any etching. Also, DFR is confirmed low consumption power because DFR has very lower thermal conductivity (2.33 W/mK) in comparison with silicon (168 W/mK) therefore displays high performance in heating an internal sample. As DFR is hydrophilic, it can bond with glasses without any treatment. Therefore, anodic bonding process using silicon bulk micromachining or an RIE … Show more

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Cited by 4 publications
(2 citation statements)
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“…So, the effect on the temperature distribution due to convective heat transfer inside the microchannel is assumed to be negligible when the flow rate of the sample in the microchannel is less than 5 ll/min. Because of the information found in prior literature, 2,5,8,12,14,15,[26][27][28][29][30][31] in order to make sure that the DNA amplification process is successful, the Re of the sample flow inside the microchannel was chosen to be less than 1. In our simulated results, the uniformity of the chip temperature at a specific reaction region is assured when the flow rate of the sample in the microchannel is less than 5 ll/min or the Re of the sample flow is less than 1.…”
Section: Design Conceptmentioning
confidence: 99%
“…So, the effect on the temperature distribution due to convective heat transfer inside the microchannel is assumed to be negligible when the flow rate of the sample in the microchannel is less than 5 ll/min. Because of the information found in prior literature, 2,5,8,12,14,15,[26][27][28][29][30][31] in order to make sure that the DNA amplification process is successful, the Re of the sample flow inside the microchannel was chosen to be less than 1. In our simulated results, the uniformity of the chip temperature at a specific reaction region is assured when the flow rate of the sample in the microchannel is less than 5 ll/min or the Re of the sample flow is less than 1.…”
Section: Design Conceptmentioning
confidence: 99%
“…Recently, dry film photopolymers have moved away from their original purpose of providing sacrificial layers for the fabrication of printed circuit boards and were used for fabricating electroplating moulds [34,35], stamp cavities [36] and replication tools [37,38], for wafer bonding [39,40] and sensor packaging [41], as an etch mask for silicon-DRIE [42] and as a permanent material for microfluidic applications [43][44][45][46]. So far, the most frequently used permanent films are Riston (DuPont) and Ordyl SY (Elga Europe).…”
Section: Selective Sealing Of Silicon Microchannelsmentioning
confidence: 99%