2000
DOI: 10.1002/1520-6432(200007)83:7<1::aid-ecjb1>3.0.co;2-3
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Anodization of Al3Zr intermetallic compound film and its application to the preparation of thin-film capacitors with high reliability

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Cited by 3 publications
(2 citation statements)
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“…Though methods for anodization of thin-film metals or intermetallics such as Al, [11] Ta, [12] TiN, [13] Ni, [14] and Al 3 Zr [15] have been reported, to our knowledge the anodization of Ti-metal thin films to obtain nanotube arrays has not. Using the techniques described herein, we are able to fabricate titania nanotube-array films with any residual metal underneath the nanotubes completely eliminated.…”
Section: Introductionmentioning
confidence: 61%
“…Though methods for anodization of thin-film metals or intermetallics such as Al, [11] Ta, [12] TiN, [13] Ni, [14] and Al 3 Zr [15] have been reported, to our knowledge the anodization of Ti-metal thin films to obtain nanotube arrays has not. Using the techniques described herein, we are able to fabricate titania nanotube-array films with any residual metal underneath the nanotubes completely eliminated.…”
Section: Introductionmentioning
confidence: 61%
“…[10][11][12] However, the capacitor properties and leakage current characteristics of anodized Zr-Al capacitors have not yet been investigated sufficiently, except for one fabricated using an Al 3 Zr intermetallic compound film. 13) In this study, we investigated the fundamental capacitor properties, such as capacitance density (C), dissipation factor (tan ), TCC, and leakage current mechanism, of a Zr-Al thin film capacitor prepared by anodic oxidation. In addition, we examined the cause of thermal degradation observed above 350 C from the compositional depth profiles obtained by Auger electron spectroscopy (AES).…”
Section: Introductionmentioning
confidence: 99%