2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) 2013
DOI: 10.1109/edaps.2013.6724431
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Anti-resonance peak shift due to variation of effective package inductance

Genki Kubo
1
,
Hiroki Otsuka
2
,
Ryota Kobayashi
3
et al.
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Cited by 4 publications
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Q factor damping of anti-resonance peak by variable on-die capacitance

Ichimura
1
,
Kiyoshige
2
,
Terasaki
3
et al. 2014
2014 International Symposium on Electromagnetic Compatibility
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Q factor damping of anti-resonance peak by variable on-die capacitance

Ichimura
1
,
Kiyoshige
2
,
Terasaki
3
et al. 2014
2014 International Symposium on Electromagnetic Compatibility
Self Cite
3
0
0
0
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EMI reduction by suppressing Q factor of total PDN with variable on-die capacitance and resistance

Ichimura
1
,
Kiyoshige
2
,
Sudô
3
2014
2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems
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A simple yet precise capacitance estimation method for on-chip power delivery network towards EMC analysis

Kanamoto
1
,
Kasai
2
,
Hatakeyama
3
et al. 2020
IEICE Electron. Express
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