2019
DOI: 10.1016/j.surfcoat.2019.05.075
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Application and evaluation of nitriding treatment using active screen plasma

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Cited by 17 publications
(7 citation statements)
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“…Thus, it is expected that high-quality diamond films can be deposited directly onto plasma-nitrided WC-Co substrates by tuning the content and distribution of Co4N in the surface layer. Similar to the nitriding of ferrous alloys [23,24], Ar + , N + , and H + , with high energy and present in the plasma produced at a bias voltage of 400 V, bombard the surface of the substrate and sputter-out the Co atoms; the sputtering efficiency of the ions increases in the order Ar + > N + > H + . A fraction of the sputtered Co atoms reacts with the active nitrogen in the plasma to form Co4N, which redeposits on the surface to form the white Co-rich particles.…”
Section: Effect Of the Conversion Layer On Hfcvdmentioning
confidence: 99%
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“…Thus, it is expected that high-quality diamond films can be deposited directly onto plasma-nitrided WC-Co substrates by tuning the content and distribution of Co4N in the surface layer. Similar to the nitriding of ferrous alloys [23,24], Ar + , N + , and H + , with high energy and present in the plasma produced at a bias voltage of 400 V, bombard the surface of the substrate and sputter-out the Co atoms; the sputtering efficiency of the ions increases in the order Ar + > N + > H + . A fraction of the sputtered Co atoms reacts with the active nitrogen in the plasma to form Co4N, which redeposits on the surface to form the white Co-rich particles.…”
Section: Effect Of the Conversion Layer On Hfcvdmentioning
confidence: 99%
“…A Co-boride layer in the surface is able to delete the Co catalysis, then how about Co-nitrides? Plasma nitriding has been successfully used for hardening ferrous alloys [23,24]; however, there are significant challenges when plasma nitriding is used in the surface modification of WC-Co cermets. According to the W-Co-C ternary phase diagram, the solubility of Co with the other constituents, the decomposition of WC phases, and the constituent phase structure vary with temperature and the media atmosphere [25][26][27].…”
Section: Introductionmentioning
confidence: 99%
“…Active screen plasma nitriding (ASPN) is an excellent method for the further utilization of active species and the generation of uniform heating regions. The screen suppresses the edge effect by increasing the supply of active species such as N + , N 2 + and H + and by heating the sample surface uniformly [17][18][19][20][21][22][23][24][25][26][27][28][29][30][31][32]. However, nitriding on small-diameter thin pipes has not been reported yet [30].…”
Section: Introductionmentioning
confidence: 99%
“…As the cathode of the metal screen is bombarded by ions, iron particles are continuously sputtered and deposited on the workpiece, and nitrogen atoms diffuse into the inner part of the suspended workpiece to avoid the above problems during CPN treatment. Since the plasma is formed by the glow discharge generated by the active screen, the workpiece should be closer to the active screen [17][18][19] .…”
Section: Introductionmentioning
confidence: 99%