Application of flash-light sintering method to flexible inkjet printing using anti-oxidant copper nanoparticles

Son, Yeon-Ho; Jang, Joonyoung; Kang, Min Kyu; Ahn, Sung‐Hoon; Lee, Caroline Sunyong

doi:10.1016/j.tsf.2018.04.034

Cited by 40 publications

(19 citation statements)

References 30 publications

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“…The Cu nanoparticle ink (10% Cu mass, a solvent of 1-octanol) provided a highly conductive film of 26.3 and 5.69 μΩ·cm sintered at 150 and 200 °C, respectively, under a hydrogen gas atmosphere. They further employed the IPL sintering method with preheating at 250 °C under hydrogen gas to inkjet patterns printed on a flexible PI film from the ink of Cu nanoparticles with a 1-octane thiol coating layer [ 83 ]. The optimal light-sintering condition was 24.7 J/cm 2 of energy density from a 5 ms pulse, which resulted in a resistivity of 24 μΩ·cm.…”

Section: Surface Designs By Surface Protective Layers Against the mentioning

confidence: 99%

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Tomotoshi

Kawasaki

2020

Nanomaterials

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Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising candidate for metal-based inks/pastes. Cu has high intrinsic electrical/thermal conductivity, which is more cost-effective and abundant, as compared to Ag. Moreover, the migration tendency of Cu is less than that of Ag. Thus, recently, Cu-based inks/pastes have gained increasing attention as conductive inks/pastes for printed/flexible electronics. However, the disadvantages of Cu-based inks/pastes are their instability against oxidation under an ambient condition and tendency to form insulating layers of Cu oxide, such as cuprous oxide (Cu2O) and cupric oxide (CuO). The formation of the Cu oxidation causes a low conductivity in sintered Cu films and interferes with the sintering of Cu particles. In this review, we summarize the surface and interface designs for Cu-based conductive inks/pastes, in which the strategies for the oxidation resistance of Cu and low-temperature sintering are applied to produce highly conductive Cu patterns/electrodes on flexible substrates. First, we classify the Cu-based inks/pastes and briefly describe the surface oxidation behaviors of Cu. Next, we describe various surface control approaches for Cu-based inks/pastes to achieve both the oxidation resistance and low-temperature sintering to produce highly conductive Cu patterns/electrodes on flexible substrates. These surface control approaches include surface designs by polymers, small ligands, core-shell structures, and surface activation. Recently developed Cu-based mixed inks/pastes are also described, and the synergy effect in the mixed inks/pastes offers improved performances compared with the single use of each component. Finally, we offer our perspectives on Cu-based inks/pastes for future efforts.

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Section: Surface Designs By Surface Protective Layers Against the mentioning

confidence: 99%

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Tomotoshi

Kawasaki

2020

Nanomaterials

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“…The inks, consisting of well-dispersed nanomaterials in homogeneous solvents, are ejected by a piezoelectric device as tiny microscale droplets (Fig. 7a), which are directly deposited on the designated places on the substrate [114][115][116][117][118][119][120][121][122][123][124]. In a typical example, a suitable ink was obtained by dispersing the CuNPs in a mixture of 2amino-2-methyl-1-propanol and distilled water at pH 9 with a wetting agent at a concentration of 0.1 wt%.…”

Section: Controlled Ink Patterningmentioning

confidence: 99%

Copper nanomaterials and assemblies for soft electronics

Yang

Zhu

2019

Sci. China Mater.

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Soft electronics that can simultaneously offer electronic functions and the capability to be deformed into arbitrary shapes are becoming increasingly important for wearable and bio-implanted applications. The past decade has witnessed tremendous progress in this field with a myriad of achievements in the preparation of soft electronic conductors, semiconductors, and dielectrics. Among these materials, copper-based soft electronic materials have attracted considerable attention for their use in flexible or stretchable electrodes or interconnecting circuits due to their low cost and abundance with excellent optical, electrical and mechanical properties. In this review, we summarize the recent progress on these materials with the detailed discussions of the synthesis of copper nanomaterials, approaches for their assemblies, strategies to resist the ambient corrosion, and their applications in various fields including flexible electrodes, sensors, and other soft devices. We conclude our discussions with perspectives on the remaining challenges to make copper soft conductors available for more widespread applications.

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“…Unfortunately, the majority of flexible substrates, which are thermoplastics like PEN or PET, have low glass transition and melting temperatures and consequently they can't be exposed to temperatures in the order of 200-300°C in a furnace. Thus, alternative methods of sintering had to be employed in order to fabricate conductive patterns, such as chemical [17] and photonic sintering [18][19][20][21][22][23][24][25][26][27][28][29][30].…”

Section: Introductionmentioning

confidence: 99%

“…Flash light sintering can cover a very large area of the printed substrate with a single pulse, offering no lateral selectivity and the resulting heat affected zone might be extended. Flash light sintering of copper nanoparticle inks has been studied thoroughly in the last decade [18][19][20][21][22][23], with the best resistivity value (5 µΩ•cm), achieved from H-S. Kim et al [23], in 2009. On the other hand, laser pulses are spatially confined in a small area, and the sintering process is performed by scanning the laser beam over the printed pattern.…”

Section: Introductionmentioning

confidence: 99%

Copper micro-electrode fabrication using laser printing and laser sintering processes for on-chip antennas on flexible integrated circuits

Koritsoglou

Theodorakos

Zacharatos

et al. 2019

Opt. Mater. Express

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Recent advances in flexible electronics have highlighted the importance of high throughput, digital additive microfabrication techniques. In this work, we demonstrate the combination of laser printing and laser sintering of a novel copper nanoparticle ink onto flexible substrates in order to produce oxide free conductive copper patterns in ambient atmospheric conditions. The printed patterns exhibit high reproducibility, very low resistivity (about 2x bulk), and negligible oxidation according to Raman spectroscopy. The process has been employed for the fabrication of an on-chip antenna on a flexible substrate for use in combination with a flexible circuit, in applications where a small form factor and simplicity of integration are required alongside ultra-low cost, e.g. consumable tagging.

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Application of flash-light sintering method to flexible inkjet printing using anti-oxidant copper nanoparticles

Cited by 40 publications

References 30 publications

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Copper nanomaterials and assemblies for soft electronics

Copper micro-electrode fabrication using laser printing and laser sintering processes for on-chip antennas on flexible integrated circuits

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