2019
DOI: 10.1002/mdp2.101
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Application of hot isostatic pressing (HIP) technology to diffusion bond refractory metals for proton beam targets and absorbers at CERN

Abstract: A target assembly, composed of several collinear molybdenum (Mo)‐based and tungsten (W)‐based cylindrical blocks, will reside in the core of the new beam dump facility (BDF) being designed at the European Laboratory for Particle Physics (CERN). The target blocks will be protected from the cooling water erosion‐corrosion by a tantalum (Ta)‐based cladding. In order to obtain intimate and reliable bonding between the several cylinders composing each target block and with the cladding, hot isostatic pressing (HIP)… Show more

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Cited by 12 publications
(11 citation statements)
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“…At the design stage of the target prototype, a good mechanical and chemical bonding between tungsten and Ta2.5W had not been produced via the HIP process. A successful bonding was later on achieved by adapting the HIP parameters employed [19], validating the use of Ta2.5W as cladding material for all the target blocks in the final BDF target.…”
Section: B Prototype Target Corementioning
confidence: 99%
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“…At the design stage of the target prototype, a good mechanical and chemical bonding between tungsten and Ta2.5W had not been produced via the HIP process. A successful bonding was later on achieved by adapting the HIP parameters employed [19], validating the use of Ta2.5W as cladding material for all the target blocks in the final BDF target.…”
Section: B Prototype Target Corementioning
confidence: 99%
“…The use of Ta2.5W as cladding material is novel for a production target, while pure tantalum has already proven to be a reliable cladding material for tungsten blocks in other facilities (LANSCE, KENS and ISIS neutron source) [16][17][18]. Therefore, in the BDF target prototype both pure tantalum and Ta2.5W were used as cladding materials to compare their performance under beam irradiation [19].…”
Section: B Prototype Target Corementioning
confidence: 99%
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“…The excellent corrosion resistance of tantalum would solve the contamination issues, while the better thermo-mechanical properties of tungsten and tantalum (compared to lead) would eliminate any thermo-structural concern even for higher average power on target. Moreover, the HIP process would provide an excellent thermal conductance at the Ta-W interface and a lot of experience had already been acquired at CERN on R&D of HIPed Ta-W assemblies [8]. For the external tungsten mass, a gas circuit or even natural convection would suffice for an adequate cooling.…”
Section: Target #3: Evolution Of the Designmentioning
confidence: 99%
“…Details about the process are reported extensively in Ref. [12] together with the relevant references.…”
Section: Introductionmentioning
confidence: 99%