Application of Low Temperature Atomic Layer Deposition Packaging Technology in OLED and Its Implications for Organic and Perovskite Solar Cell Packaging

Applications of vacuum vapor deposition for perovskite solar cells: A progress review

“…ALD is a self-limiting vapor deposition method, which comprises of a binary sequence of successive, self-terminating and irreversible vapor-solid chemical reactions [65] . For the first half-reaction of ALD, a gaseous precursor is chemisorbed onto the substrate and afterwards byproducts and unreacted precursor are purged out of the vacuum chamber.…”

“…A buffer layer should be employed to protect the sensitive perovskite layer. Considering the low thermal tolerance of the underlying perovskite, ALD is an ideal method for depositing the buffer layer between the CTL and transparent electrode [65] . The most commonly-used ALD buffer layer is SnO 2 for top cells with a p-i-n structure, which can facilitate the charge transport and inhibit water penetration to improve stability without sacrificing the light transmittance [44,45] .…”

Tailoring the efficient laser‐absorption‐melting behavior of Bi2O3‐B2O3‐ZnO‐Nd2O3 glass for the OLED encapsulation

“…Since the advent of Organic Light Emitting Display (OLED) technology, it has attracted wide attention in the scientific and industrial areas due to its advantages of all‐solid‐state, high luminous efficiency, ultra‐thin, low power consumption, low cost, and excellent color saturation, which is called the third‐generation display 1,2 . However, the cathode and organic materials of OLED devices are extremely sensitive to water vapor and oxygen and are vulnerable to damage, which greatly limits the life of OLED devices 2,3 . Hence, the high reliability, high stability, and strong durability of the hermetic encapsulation technique has been one of the most critical variables for the practical application of OLED displays and lighting devices.…”

“…1,2 However, the cathode and organic materials of OLED devices are extremely sensitive to water vapor and oxygen and are vulnerable to damage, which greatly limits the life of OLED devices. 2,3 Hence, the high reliability, high stability, and strong durability of the hermetic encapsulation technique has been one of the most critical variables for the practical application of OLED displays and lighting devices. There are commonly three packaging technology including the cover plate encapsulation using UV-cured epoxy, thin-film packaging such as the Barix and TFE technology, and laser-assisted glass frit packaging.…”