Application of phase change materials in handheld computing devices

Moore, Darryl; Raghupathy, A.; Maltz, William

doi:10.1109/semi-therm.2016.7458468

Cited by 5 publications

(2 citation statements)

References 4 publications

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“…Skach et al were reported the thermal time shifting with a PCM can be used to reduce peak cooling load by up to 12 percent or increase the number of servers by up to 14.6 percent without increasing the cooling load (Skach et al, 2017). Furthermore, since it is difficult to use fans in mobile device cooling systems, applications of PCM has been studied (Moore et al, 2016 andShao et al, 2014).…”

Section: Introductionmentioning

confidence: 99%

Thermal network calculation model for phase change material with SPICE circuit simulator

Ishii

Hatakeyama

Ishizuka

2020

JTST

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Section: Introductionmentioning

confidence: 99%

Thermal network calculation model for phase change material with SPICE circuit simulator

Ishii

Hatakeyama

Ishizuka

2020

JTST

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“…3,4 Among various electronic devices, mainly handheld consumer products are subjected to highly variable processor load and generate a substantial amount of heat intermittently. 5 A load of a device may increase due to multifunctionality such as a short phone call, social media activity, or while playing games. In existing technique, transient thermal loads are managed by throttling or adding mass to increase the thermal capacitance of the materials used.…”

Section: Introductionmentioning

confidence: 99%

Paraffin wax microsphere embedded epoxy composites for potential thermal management in electronic devices

Khagokpam

Halder

2018

High Performance Polymers

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Miniaturization of electronic devices with more computing power has created a challenging set of aspects in thermal management. Present work is based on phase change materials microsphere and its incorporation in the epoxy network to develop a new class of potting material facilitating thermal management for miniaturized electronic devices. A facile and scalable method was implemented to synthesize paraffin wax microspheres (PMPs). It was dispersed into a room temperature curing epoxy network to fabricate the epoxy composite with high latent heat of fusion and high thermal stability. PMPs obtained have spherical morphology with an average diameter of approximately 5 µm. The PMP/epoxy composite can store 34.34 and 49.3 J g−1 of latent heat energy at 30 and 40 wt% PMP loading, respectively. Leakage test reveals that leaching declined as the size of PMP is reduced. Incorporation of PMP into the epoxy network reduces the compressive strength, but still resilient enough to protect electronic devices. This is an added advantage over the potential to mitigate the issue of hot spot in electronic devices as demonstrated by infrared thermography. The application of such composite is not limited only as electronic potting materials but also has the potential for other thermal energy storage applications.

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