2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits 2007
DOI: 10.1109/ipfa.2007.4378085
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Application of Time Domain Reflectometry in Evaluating Irregular Inter-metallic Compound Growth in Gold Wire Bonds Encapsulated with Green Epoxy Mold Compound

Jing Ying Wong1,
A. Seah2,
Sheng Chew3
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