Application of Vapor Phase Soldering (VPS) for Joints Reliability Improvement

Skwarek, Agata; Synkiewicz, Beata; Witek, Krzysztof; Wroński, Sebastian

doi:10.7763/ijmo.2013.v3.304

Cited by 10 publications

(12 citation statements)

References 9 publications

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“…The heating is supposed to be homogeneous along the heater surface, enabling homogeneous vapour build-up. The process zone is oxygen-free when the vapour is saturated; the medium forms a barrier around the lowered PCBA [25][26][27]. The maximum heating temperature is limited by the boiling temperature of the applied Galden fluid.…”

Section: The Applied Vps Ovenmentioning

confidence: 99%

“…For our experiment, a heat transfer medium with 230 • C boiling point (LS230) was applied, which is widely used in modern lead-free soldering. The boiling point limited temperature eliminates usual overheating damages, common to other soldering methods [25][26][27], such as the delamination of the PCB or the damage to components [28].…”

Section: The Applied Vps Ovenmentioning

confidence: 99%

“…The construction of the retrofitted TC is a fast-response, general-purpose welded tip PFA (perfluoroalkoxy) insulated sensor. These TCs can be placed inside the workspace in a flexible manner, without workspace and vapour perturbing fixtures (the TC type is shown in Figure 3 ered PCBA [25][26][27]. The maximum heating temperature is limited by the boiling temperature of the applied Galden fluid.…”

Section: Applied Sensorsmentioning

confidence: 99%

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Validation of Heat-Level Vapor Phase Soldering Process and Workspace Leakage Detection with Applied Pressure Sensors

et al. 2021

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Electronic manufacturing principles are continuously developing, further improving assembly quality and productivity. There is a continuous need to apply novel and improved methods of process monitoring to provide accurate measurement and control during assembling. In this paper, a new principle for monitoring filmwise condensation-based heat-level—vapour phase soldering (HL-VPS) is presented to improve the process control. The experiment is based on thermocouple sensors in fusion with a sensitive gauge type pressure sensor. The aim is to precisely identify the steps of condensation-based reflow heat transfer process with commercially available components and the mindset of possible retrofitting in the generally used HL-VPS soldering ovens. It was found that the gauge sensor can follow the state of the workspace more precisely as the thermocouples, by monitoring the hydrostatic state of the vapour. The pressure (time) function gives information about the build-up of the vapour column, highlighting four characteristic steps (phases) of the process, meaning: immersion of the sample to be soldered, condensation-based heat transfer, solder-break, and cooling. Combined application with thermocouples enables more precise control, improving soldering quality and can reduce idle time of the oven. In addition, it was showed that the gauge type sensors could highlight any failure in the oven sealing by a sensor signal threshold detection. The original concept of workspace identification also fits the present and future industry 4.0 directives.

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Section: The Applied Vps Ovenmentioning

confidence: 99%

Section: The Applied Vps Ovenmentioning

confidence: 99%

Section: Applied Sensorsmentioning

confidence: 99%

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Validation of Heat-Level Vapor Phase Soldering Process and Workspace Leakage Detection with Applied Pressure Sensors

et al. 2021

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“…Many aspects of vapour phase soldering have been reported recently, for example, the numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system (Illés et al, 2017), studying heat transfer on inclined PCBs during vapour phase soldering (Géczy et al, 2017), influence of vapour phase soldering fluid Galden on wetting forces (Dušek et al, 2018). The issue of voids inside the solder joints was investigated by Skwarek et al (2013) and Synkiewicz et al (2014) where elimination of voids was achieved by applying vacuum at the end of the heating ramps of the vapour phase soldering process. The investigations concerned voids in solder joints made of PbSn and SAC305 alloys; in the investigations, the 1206 surface mount resistors were tested.…”

Section: Introductionmentioning

confidence: 99%

Convection vs vapour phase reflow in LED and BGA assembly

Dziurdzia

Sobolewski²,

Mikołajek³

2018

SSMT

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Purpose The aim of this paper is to evaluate using statistical methods how two soldering techniques – the convection reflow and vapour phase reflow with vacuum – influence reduction of voids in lead-free solder joints under Light Emitted Diodes (LEDs) and Ball Grid Arrays (BGAs). Design/methodology/approach Distribution of voids in solder joints under thermal and electrical pads of LEDs and in solder balls of BGAs assembled with convection reflow and vapour phase reflow with vacuum has been investigated in terms of coverage or void contents, void diameters and number of voids. For each soldering technology, 80 LEDs and 32 solder balls in BGAs were examined. Soldering processes were carried out in the industrial or semi-industrial environment. The OM340 solder paste of Innolot type was used for LED soldering. Voidings in solder joints were inspected with a 2D X-ray transmission system. OriginLab was used for statistical analysis. Findings Investigations supported by statistical analysis showed that the vapour phase reflow with vacuum decreases significantly void contents and number and diameters of voids in solder joints under LED and BGA packages when compared to convection reflow. Originality/value Voiding distribution data were collected on the basis of 2D X-ray images for test samples manufactured during the mass production processes. Statistical analysis enabled to appraise soldering technologies used in these processes in respect of void formation.

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“…The issue of trapped gas voids inside the joints is usually accounted for by the use of improper heating settings during reflow. This effect was investigated by Skwarek et al (2013) and Synkiewicz et al (2014) where their elimination was achieved by applying vacuum at the end of the heating ramps of the process. Vacuum VPS was also investigated by Lungen et al (2015), where the research team pointed to the quality improving importance of a proper temperature profile setting and the void reducing capability of the vacuum.…”

Section: Introductionmentioning

confidence: 99%

Studying heat transfer on inclined printed circuit boards during vapour phase soldering

Géczy

Nagy

Illés

et al. 2017

SSMT

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Purpose The paper aims to present an investigation of heating during vapour phase soldering (VPS) on inclined printed circuit board (PCB) substrates. The PCB is a horizontal rectangular plate from the aspect of filmwise condensation with a given inclination setting. Design/methodology/approach The paper focuses on the measurement of temperature distribution on the PCBs with a novel setup immersed in the saturated vapour space. The measuring instrumentation is optimized to avoid and minimize vapour perturbing effects. Findings The inhomogeneity of the heating is presented according to the lateral dimensions of the PCB. The inclination improves temperature uniformity, improves heat transfer efficiency; however, a minor misalignment may affect the flow and result in uneven heating. Practical implications The results can be implemented for practical improvements in industrial ovens with the use of intended inclination. The improvements may consequently point to more efficient production and better joint quality. Originality/value The novel method can be used for deeper investigation of inclination during and can be complemented with numerical calculations. The results highlight the importance of precise PCB holding instrumentation in VPS ovens.

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Application of Vapor Phase Soldering (VPS) for Joints Reliability Improvement

Cited by 10 publications

References 9 publications

Validation of Heat-Level Vapor Phase Soldering Process and Workspace Leakage Detection with Applied Pressure Sensors

Validation of Heat-Level Vapor Phase Soldering Process and Workspace Leakage Detection with Applied Pressure Sensors

Convection vs vapour phase reflow in LED and BGA assembly

Studying heat transfer on inclined printed circuit boards during vapour phase soldering

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