Polycrystalline Silicon for Integrated Circuits and Displays 1998
DOI: 10.1007/978-1-4615-5577-3_6
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Cited by 5 publications
(20 citation statements)
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“…The gap between the substrate and the free structures is 2 µm. The measured resistivity of the B-doped poly-Si was 3 × 10 −3 cm at room temperature, which corresponds to a doping concentration of approximately 8 × 10 19 atoms cm −3 [6]. The resistivity of highly doped poly-Si approaches the resistivity of highly doped single-crystal Si [6], thus the estimated intrinsic temperature of the poly-Si with a doping concentration of 8 × 10 19 B atoms cm −3 [7] is 1300 K.…”
Section: Distinction Of Reversible and Irreversible Actuation Regionsmentioning
confidence: 89%
See 1 more Smart Citation
“…The gap between the substrate and the free structures is 2 µm. The measured resistivity of the B-doped poly-Si was 3 × 10 −3 cm at room temperature, which corresponds to a doping concentration of approximately 8 × 10 19 atoms cm −3 [6]. The resistivity of highly doped poly-Si approaches the resistivity of highly doped single-crystal Si [6], thus the estimated intrinsic temperature of the poly-Si with a doping concentration of 8 × 10 19 B atoms cm −3 [7] is 1300 K.…”
Section: Distinction Of Reversible and Irreversible Actuation Regionsmentioning
confidence: 89%
“…The dopant concentration for polycrystalline-Si at which the number of active carriers saturates is approximately 2 × 10 20 [6]. According to [7], higher dopant concentration causes higher intrinsic temperature that can be well above the temperature limit at which plastic deformation initiates due to Joule heating.…”
Section: Introductionmentioning
confidence: 99%
“…Polysilicon is a widely used key material in the photovoltaic systems, energy-storage devices, and semiconductor sectors. With the development of these industries, the preparation of high-quality and high-purity polysilicon has become increasingly crucial. Currently, the most common method for preparing high-purity polysilicon is chemical vapor deposition (CVD), which primarily employs silicon hydrogen compounds as precursors, as shown in Figure .…”
Section: Introductionmentioning
confidence: 99%
“…[9] Moreover, poly-Si is compatible with the mature integrated circuit (IC) manufacturing process, and its thermal stability is very good. [13] In 2005, Raskin et al developed the TR-SOI substrate. [11] Poly-Si film is used as the traprich layer for the TR-SOI substrate.…”
mentioning
confidence: 99%