The electronic interconnections in the state-of-the-art integrated circuit (IC) manufacturing are scaled down to the micron or sub-micron scale. This results in a dramatic increase in the current density passing through interconnections, so the electromigration (EM) effect plays a significant role in the reliability of products.Although thorough studies and reviews of EM effects have been continuously conducted in the past 60 years, some parts of EM theories lack clear elucidation of the electric current-induced non-directional effects, including the electric current-induced phase equilibrium changes. This review article is intended to provide a broad picture of
Recent-proposed models (Machine learning model)Recently, Liu et al. performed the machine learning method with an