2010
DOI: 10.1007/s00542-009-1011-2
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Applying SU-8™ to the fabrication of micro electro discharge machining electrodes

Abstract: Taking advantage of high aspect ratio micro structure technology (HARMST) allows a cost competitive approach to batch fabricate a high number of tool electrodes for micro electro discharge machining (EDM). A new type of EDM tool micro electrode fabrication was developed using a combination of near UV lithography to directly polymerize a micromold made of SU-8 TM in combination with electroplating. Applying SU-8 TM for the fabrication of deep hollow micromolds, an ultra-thin resist film remains on the seed laye… Show more

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Cited by 4 publications
(5 citation statements)
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“…4. Traisigkhachol et al (2010) found such SU-8 TM residue on the Au seed layer at the bottom of the SU-8 TM micromold and removed it with plasma ashing. For the electroplating of high micro electrodes, the seed layer has to feature a high adhesion to the electrode.…”
Section: Su-8 Tmmentioning
confidence: 99%
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“…4. Traisigkhachol et al (2010) found such SU-8 TM residue on the Au seed layer at the bottom of the SU-8 TM micromold and removed it with plasma ashing. For the electroplating of high micro electrodes, the seed layer has to feature a high adhesion to the electrode.…”
Section: Su-8 Tmmentioning
confidence: 99%
“…Au was deposited using magnetron sputtering. Unfortunately, Cu provided only a poor adhesion to the SU-8 TM micromolds (Traisigkhachol et al 2010). By applying Ni as an interlayer between the Cu seed layer and the SU-8 TM micromolds, a better adhesion and chemical resistance was achieved.…”
Section: Su-8 Tmmentioning
confidence: 99%
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