Selective area doping in GaN, especially p-type, is a critical and inevitable building block for 
the realization of advanced device structures for high-power applications, including, but not 
limited to, current-aperture vertical electron transistors (CAVETs), junction termination 
extensions (JTEs), junction barrier Schottky (JBS) diodes, junction field-effect transistors 
(JFETs), vertical-channel junction FETs (VC-JFETs), U-shaped metal–oxide–semiconductor 
field-effect transistors (U-MOSFETs), and Fin MOSFETs. This paper reviews and 
summarizes some of the recent advances in the fields of selective area etching and regrowth, 
ion implantation, and polarity-dependent doping that may lead to the practical realization of 
GaN-based power devices.