2014
DOI: 10.1116/1.4890119
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Ar ions and oxygen plasma interactions of amine terminated organosilicate glass: A combined experimental and ab initio simulations study

Abstract: Articles you may be interested inEffects of plasma and vacuum-ultraviolet exposure on the mechanical properties of low-k porous organosilicate glass J. Appl. Phys. 116, 044103 (2014); 10.1063/1.4891501 Reaction mechanisms of oxygen plasma interaction with organosilicate low-k materials containing organic crosslinking groups J. Vac. Sci. Technol. A 30, 061302 (2012); 10.1116/1.4755898 Time-dependent dielectric breakdown of plasma-exposed porous organosilicate glass Appl. Phys. Lett. 100, 112905 (2012); 10.1063/… Show more

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Cited by 13 publications
(6 citation statements)
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“…26,27 Activation energies vary with solution compositions, temperature, and the use of bulk or powdered samples. 28,29 Energy barriers are lower than the Si-O bond energies of 5-6 eV 30 indicating the important role that water plays in lowering energy barriers. Criscenti et al 19 attempted to identify a connection between the connectedness of the silicon and stability of related siloxane bonds but did not find a clear relationships, indicating the complexity of the silica dissolution mechanisms.…”
Section: First-principles-based Simulations Of Glass-water Interactionsmentioning
confidence: 99%
“…26,27 Activation energies vary with solution compositions, temperature, and the use of bulk or powdered samples. 28,29 Energy barriers are lower than the Si-O bond energies of 5-6 eV 30 indicating the important role that water plays in lowering energy barriers. Criscenti et al 19 attempted to identify a connection between the connectedness of the silicon and stability of related siloxane bonds but did not find a clear relationships, indicating the complexity of the silica dissolution mechanisms.…”
Section: First-principles-based Simulations Of Glass-water Interactionsmentioning
confidence: 99%
“…[66][67][68] The loss of such terminal organic groups in low-k a-SiOC:H dielectrics typically results in the formation of new chemical bonds and a more SiO 2 like composition. 69,70 These effects are most commonly observed as "sidewall damage" resulting from plasma etch and ashing processes that convert to SiO 2 the sidewalls of trenches etched into the low-k a-SiOC:H dielectric. This "sidewall damage" becomes readily apparent after dilute HF cleans where the SiO 2 damage layer is selectively etched away resulting in a widening of the formed trench and undercut of any overlying hard mask materials.…”
Section: Absorbance (Au)mentioning
confidence: 99%
“…The differences between the computational Si-C values reported here and the experimental value of 1.97Å maybe the result the relative weakness of the Si-CH3 bond compared to the Si-O bonds which are present, in contrast to the hexamethydisilane where each Si is bonded to three methyl groups and the neighboring silicon atom [46]. Previous DFT studies on TMCTS (trimethylcylictrisiloxane) molecule identified a Si-CH3 bond length of 1.89Å when the Si coordination environment contains two bridging oxygen, one hydrogen, and a methyl group, demonstrating a slight Si-C bond lengthening with an increase in the number of bridging oxygen [6]. Furthermore, the bulk silica surface may cause lengthening of the Si-CH3 bond and may factor in the slightly longer Si-CH3 bond length.…”
Section: Pair Distribution Functions (Pdf) Analysismentioning
confidence: 96%
“…For dense silica experimental methods including NMR (nuclear magnetic resonance) and electron diffraction have been effective in providing some insight into the coordination environments, bond lengths, and bond angles [5]. The addition of light organic elements to the nanoporous silica to form OSG generates an increasingly complex system which has undergone limited experimental analysis, with the expectation of FTIR which has provide information on various bond concentrations [6,7].…”
Section: Introductionmentioning
confidence: 99%