Arbitrary Modeling of TSVs for 3D Integrated Circuits

Ismail, Yehea; El-Rouby, Alaa

doi:10.1007/978-3-319-07611-9

Cited by 6 publications

(3 citation statements)

References 13 publications

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“…9 7 ) H i g h e s t ( 2 0 0 , 9 1 . 9 4 ) Even though 0.75-turns with rectangular pillars exhibit a better Q dc than with circular pillars, 0.75-turns with circular pillars is chosen for constructing a novel inductor structure, which is discussed in the next section, for the following reasons: (a) the stress profile of a circular pillar is better than a rectangular pillar [57], [58], and (b) constructing rectangular pillars with a high aspect ratio is difficult.…”

Section: ) Full-turn With Circular Pillarsmentioning

confidence: 99%

Design, Modeling, and Analysis of a 3-D Spiral Inductor With Magnetic Thin-Films for PwrSoC/PwrSiP DC-DC Converters

Shetty

Smallwood

2022

IEEE Access

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Section: ) Full-turn With Circular Pillarsmentioning

confidence: 99%

Design, Modeling, and Analysis of a 3-D Spiral Inductor With Magnetic Thin-Films for PwrSoC/PwrSiP DC-DC Converters

Shetty

Smallwood

2022

IEEE Access

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“…However, Moore's law will cease to work beyond the 7 nanometer geometry in the foreseeable future due to considerable research and development (R and D) spending for the development of disruptive technologies [2]. Conversely, for the purpose of the sustainable development in the global semiconductor industry, emerging three-dimensional integrated circuit (3DIC) integration technologies have demonstrated their importance as potential candidates for extending the lifespan of Moore's Law [3].…”

Section: Background and Motive For Studymentioning

confidence: 99%

“…This study then used the average value approach to integrate the 16 experts' fuzzy judgment values with respect to each criterion, as shown in Table 8. (2) Check the consistency of the experts' opinions.…”

Section: Third Stage: Rate the Alternatives Using Fuzzy Topsismentioning

confidence: 99%

Technology Evaluation and Selection of 3DIC Integration Using a Three-Stage Fuzzy MCDM

Lee

Chou

2016

Sustainability

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Abstract:For the purpose of the sustainable development in the global semiconductor industry, emerging three-dimensional integrated circuit (3DIC) integration technologies have demonstrated their importance as potential candidates for extending the lifespan of Moore's Law. This study aimed to explore a technology selection process involving a three-stage fuzzy multicriteria decision-making (MCDM) approach to facilitate the effective assessment of emerging 3DIC integration technologies. The fuzzy Delphi method was first used to determine the important criteria. The fuzzy analytic hierarchy process (fuzzy AHP) was then adopted to derive the weights of the criteria. The fuzzy technique for order of preference by similarity to ideal solution (fuzzy TOPSIS) was finally deployed to rate the alternatives. Empirical results indicate that market potential, time-to-market, and heterogeneous integration are the top three decision criteria for the selection of 3DIC integration technologies. Furthermore, 2.5D through-silicon interposer (TSI) is of primary interest to the Taiwanese semiconductor industry, followed by 3DIC through-silicon via (TSV), 3D packaging, and 3D silicon TSV (Si TSV). The proposed three-stage fuzzy decision model may potentially assist industry practitioners and government policy-makers in directing research and development investments and allocating resources more strategically.

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