By employing the optical-beam-induced current (OBIC) measurement technique, we have analyzed the sudden and wear-out failure of optical devices. The extent of the degraded region is estimated by using relative OBIC intensity prior to aging. The use of OBIC incident sources at several wavelengths enables us to detect degradation in facets, epitaxial layers, and the device interior.
IntroductionOptical-beam-induced current (OBIC) measurement [1][2][3][4], as well as other approaches such as electron-beam-induced current (EBIC) measurement [5] and luminescence measurement [6], can determine the existence of deterioration in optical and electronic devices. Of these approaches, the OBIC technique has the advantages of being nondestructive and capable of selecting wavelengths [7].First, since the OBIC is measured through the window of a transistor outline (TO) can before and after aging, we are able to detect an OBIC change for several periods of aging. When there are nonradiative recombination centers in the degraded region, the OBIC intensity decreases as the recombination density increases [8]. The relative OBIC intensity prior to aging is useful for analyzing the degree of device degradation. Furthermore, the incident light that illuminates the facet is absorbed in the semiconductor. However, the lights incident on the top surface rather than the facet are absorbed in the layer to a depth of not more than a few micrometer. The OBIC measurement technique that involves illuminating the facet is therefore expected to be highly susceptible to degradation.