Assembly for micromechanics and LIGA

Schomburg, Werner Karl; Maas, D.; Bacher, W.; Büstgens, B.; Fahrenberg, J; Menz, Wolfgang; Seidel, D.

doi:10.1088/0960-1317/5/2/002

Cited by 16 publications

(7 citation statements)

References 17 publications

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“…In its present configuration, we fold the structures manually, and the method is thus limited to tessellations having millimeter dimensions. We can envision using microtools , to manipulate hinges and assemble components. We , and others , have also developed methods of self-assembly that use minimization of surface free energy to accomplish folding.…”

Section: Discussionmentioning

confidence: 99%

Microorigami: Fabrication of Small, Three-Dimensional, Metallic Structures

Brittain

Schueller

et al. 2000

J. Phys. Chem. B

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Microcontact printing (μCP) and wet chemical etching generated two-dimensional (2D) patterns in thin silver films. Electroplating silver onto these patterns increased the structural integrity of the metal layer. Separating the metal film from the substrate resulted in free-standing, 2D structures. Folding of these structures along predesigned “hinges” produced three-dimensional (3D) objects. Additional electrodeposition of nickel welded hinges into position, strengthened the structure, and joined separate pieces. By printing onto cylindrical surfaces, it was possible to generate complex shapes efficiently and to minimize joining steps.

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Section: Discussionmentioning

confidence: 99%

Microorigami: Fabrication of Small, Three-Dimensional, Metallic Structures

Brittain

Schueller

et al. 2000

J. Phys. Chem. B

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“…Assembly involves three different processes: production of parts, alignment, and bonding or securing the components [43]. Though the semiconductor and high-volume MEMS industries focus more on wafer-to-wafer bonding of devices [44], the packaging challenges in LiGA are entirely different.…”

Section: Sealing the Metal Columnsmentioning

confidence: 99%

Fabrication and Preliminary Results for LiGA Fabricated Nickel Micro Gas Chromatograph Columns

Bhushan

Yemane

Overton

et al. 2007

J. Microelectromech. Syst.

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High aspect ratio nickel microfluidic columns were fabricated using the LiGA technique. The 2-m-long 50-m-wide high aspect ratio columns will be the separation component of a handheld gas chromatograph device for detecting semivolatile and volatile compounds. As a first step, 600-m-deep electrodeposited nickel columns were fabricated. The serpentine columns were sealed and pressure-flow rate characteristics compared with the theoretical values. The response of the sealed columns was studied by running methane gas plugs through uncoated columns with a flame ionization detector at the exit. Negligible flow-induced dispersion was observed in the sealed metal columns. Unretained peak widths of 15 ms were measured, and the experimental pressure and flow rate distributions matched those predicted by established analytical models within 2.5%. Columns were coated with OV-1 stationary phase using static coating methods. A mixture of four hydrocarbons C 6 , C 8 , C 10 , and C 12 was separated in a coated 50 m by 600 m by 0.5 m column in less than 2 s at 70 C.[ 2006-0020]Index Terms-Fast gas chromatography, LiGA, micro gas chromatograph (GC), X-ray lithography.

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“…Modular systems may fulfill various functions through the combination of these distinct modules. Modularity is achieved by partitioning the design information into system level design rules, dealing with module to system interface, and hidden design parameters, dealing with the internal structure of the single modules [2], [3]. The system level design rules are common to all modules and define the architecture of the modular system, the interfaces of the modular units, and standards for testing a module's conformity to the design rules and fulfillment of specifications.…”

Section: A System Packagingmentioning

confidence: 99%

Stackable system-on-packages with integrated components

Becker

Jung

Ostmann

et al. 2004

IEEE Trans. Adv. Packag.

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In recent years, an increasing number of mobile electronic products such as mobile communicators, combining the functions of a mobile phone and a PDA are beginning to emerge. These devices are highly miniaturized and yet provide a variety of functions at ever higher speeds. Additionally, the product cycle time is getting faster, requiring short design and production cycles at ever lower cost. These trends are posing great set of challenges for the microelectronics and packaging and assembly industry. There seem to be two approaches to solve these challenges-system-in-package (SIP) by stacking of packaged integrated circuits (ICs) or system-on-package (SOP) by stacking of packages with embedded active and passive components. The buried components in SOP require significantly less space in z direction, thereby allowing the formation of three-dimensional (3-D) stackable packages. In this paper, two approaches for stacking SOPs were presented, the so-called chip-in-polymer (CIP) technology and duromer molded interconnect device (MID)/WLP technology.Index Terms-Embedded passives, modular systems, molded interconnect device (MID), packaging, system-on-package (SOP).

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Assembly for micromechanics and LIGA

Cited by 16 publications

References 17 publications

Microorigami: Fabrication of Small, Three-Dimensional, Metallic Structures

Microorigami: Fabrication of Small, Three-Dimensional, Metallic Structures

Fabrication and Preliminary Results for LiGA Fabricated Nickel Micro Gas Chromatograph Columns

Stackable system-on-packages with integrated components

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