Assembly Technology Development for 3D Silicon Stacked Module for Handheld Products

Abstract

The objective of this consortium research work is to develop a 3D SiP based on silicon platform technology for integrating heterogeneous multifunctional devices for handheld products with imaging application. The developed 3D SiP can be used for signal speed of 2Gbps with designed silicon through via structures and matched transmission lines. The thermal performance of the 3D SiP is optimized for 3 watts heat dissipation by natural convection cooling. This paper focuses on the process development of five key assembly technologies used to fabricate the 3D silicon carrier