Assessing the joints in Surface-Mounted assemblies

Sinnadurai, Nihal; Cooper, Kenneth; Woodhouse, J.D.

doi:10.1016/s0026-2692(86)80005-2

Cited by 5 publications

(3 citation statements)

References 5 publications

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“…Temperature cycling has been the most widely used method of lifetime testing of Pb containing electronic assemblies [2]. However, there has been some discussion in the literature as to whether thermal cycling can simulate the damage most likely to be seen by electronic assemblies subjected to real life power cycling experienced in the field [3]- [5]. Engelmaier [6], [7] suggested that it is not possible to recreate the thermal stress induced by power cycling using temperature cycling, either in transient or in steady state mode.…”

Section: Introductionmentioning

confidence: 99%

“…The choice of ramp rate and dwell time is also important for every accelerated ageing test. Sinnadurai et al [9] called for long dwell periods at the temperature extremes to allow time for stress relaxation. However, Frear [10] estimated that at dwell temperatures greater than 80 C, stress relaxation will be complete in 1 min, whereas at temperatures below C, this can extend over a period of days.…”

Section: Introductionmentioning

confidence: 99%

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The effect of power cycling on the reliability of lead-free surface mount assemblies

Davitt¹,

Stam

Barrett

2001

IEEE Trans. Comp. Packag. Technol.

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A power cycling in-test monitoring system has been constructed to test the reliability of eight different lead-free surface mount assemblies. The assemblies included SnAg3.8Cu0.7 and SnAg3.8Cu0.7X solder joints on OSP-Cu (organic solderability preservative on Cu), electroless NiAu, immersion Ag and immersion Sn board metallizations. One Pb containing assembly, Sn62PbAg2 on OSP-Cu board metallization, was included for comparison. The components on the assemblies were 1206 resistors (Sn100 metallization on the end terminals) and 100 lead QFP with gullwing leads (SnPb15 metallization). All assemblies experienced up to 5000 power cycles of ambient to 100 C with a 15 min dwell at each temperature. Solder joint reliability was evaluated by monitoring electrical resistance after each power cycle and examining mechanical strength and microstructure with number of power cycles. The 1206 resistors on four of the assemblies (one of which was the Pb containing assembly) exhibited electrical resistance increases after 4000 power cycles. All resistor samples decreased in strength by more than 70% at 5000 cycles and cracks appeared after 1000 power cycles. All gullwing lead solder joints exhibited good reliability over 5000 power cycles, with no resistance increase and no strength reduction. Small cracks appeared after 3000 power cycles.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

The effect of power cycling on the reliability of lead-free surface mount assemblies

Davitt¹,

Stam

Barrett

2001

IEEE Trans. Comp. Packag. Technol.

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“…It is agreed [1,2,3] that in the case of surface-mounting techniques the primary reliability hazard is thermally induced fatigue failure of the solder fillets. This fatigue is caused by cyclic thermal stresses which are generated by variations both in ambient temperature and power dissipation within components.…”

Section: Introductionmentioning

confidence: 99%

Temperature Cycling of Surface Mounted Thick Film ‘Zero‐ohm’ Jumpers

Whalley

Campbell

1987

Microelectronics International

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Thermal cycling tests for surface mounted components are usually taken around a mean temperature of approximately 35°C (e.g., -55°C to +125°C; -40°C to +110°C). To test the effect of different maximum temperatures thermal cycling tests using a lower temperature of -55°C have been conducted with alumina/thick film 'zero-ohm' jumper chips with nickel barriers. These are connected in series chains and wave soldered on to FR-4 test coupons (128 chips/coupon).The test regimes used were -55°C to +5°C; +65°C; +95°C, +110°C and +125°C.Resistance changes before and after cycling were observed at room temperature. After 100 cycles changes of approximately +200 mΩ were observed against a total resistance of 5.5 Ω. However, more detailed examination showed that a top temperature of +95°Cgives optimum results with a total change over 100 cycles of +4.9%.

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Thermal Stresses in Compliant Leaded Systems

Engel

1993

Structural Analysis of Printed Circuit Board Systems

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Assessing the joints in Surface-Mounted assemblies

Cited by 5 publications

References 5 publications

The effect of power cycling on the reliability of lead-free surface mount assemblies

The effect of power cycling on the reliability of lead-free surface mount assemblies

Temperature Cycling of Surface Mounted Thick Film ‘Zero‐ohm’ Jumpers

Thermal Stresses in Compliant Leaded Systems

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