Assessing the operating reliability of land grid array elastomer sockets

Xie, Jilin; Hillman, Craig; Sandborn, Peter; Pecht, Michael; Hassenzadeh, A.; DeDonato, D.

doi:10.1109/6144.833057

Cited by 15 publications

(1 citation statement)

References 7 publications

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“…In [3], a land grid array (LGA) structure was proposed as a reliable vertical interconnect for electronic packaging. Some related research, including reliability assessments and contact resistance predictions, were carried out to accurately evaluate and predict the performance of LGA-like structures [4][5][6][7]. For example, Xie et al presented an accurate methodology to assess the operating reliability of LGA structure using fitted distribution functions, which could be extensively applied to describe the characteristics of similar structures.…”

Section: Introductionmentioning

confidence: 99%

Multiphysics Analysis and Optimal Design of Compressible Micro-Interconnect for 2.5D/3D Heterogeneous Integration

et al. 2021

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Compressible Micro-Interconnect (CMI) shows tremendous potential in 2.5D/3D heterogeneous integration due to its outstanding performance in integration, electrical isolation, and thermal management. In this work, an optimal design approach for CMIs is developed based on a coupling framework of multiphysics simulation and particle swarm optimization (PSO). In the framework, the mechanical simulation was conducted firstly to obtain the stress distributions as CMI switched from the initial state to the working position. The contact resistance between CMI and the top pad was modeled and quantitively analyzed. Subsequently, the PSO method was utilized to implement the structural optimization of CMI to improve the performance. Multiphysics simulations of both the original and optimized CMIs were carried out and compared. With the implementation of the optimized CMIs, the contact resistance dropped from 155.3 mΩ to 108.8 mΩ, which brought significant improvement in both DC voltage drop and self-heating effect. The influence of the self-heating effect on the electrical performance of CMI is also discussed qualitatively.

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Section: Introductionmentioning

confidence: 99%

Multiphysics Analysis and Optimal Design of Compressible Micro-Interconnect for 2.5D/3D Heterogeneous Integration

et al. 2021

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An investigation of the mechanical behavior of conductive elastomer interconnects

Xie

Pecht

DeDonato³

et al. 2001

Microelectronics Reliability

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Stress relaxation in a commercial stamped metal land grid array socket

Challa

Osterman

Pecht

et al. 2008

2008 58th Electronic Components and Technology Conference

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Land grid array (LGA) sockets provide a solderless printed circuit board (PCB) attachment method for microprocessors that require high interconnect density. Stamped metal LGA sockets consist of metal contacts embedded in a plastic housing, that form the electrical and mechanical connection between the component and PCB by means of compression.To achieve a stable contact interface between the socket and component/PCB, it is necessary to maintain a minimum normal force. Stress relaxation results in a loss of normal force, and could cause an increase in contact resistance, potentially leading to a failure. Contact alloy manufacturers report stress relaxation data for the alloy in strip form. This data may not be an appropriate measure of the stress relaxation in an LGA socket because it does not take into account the geometry of the increasingly miniaturized contacts or the effect of the surrounding polymer. This paper therefore aims to study the stress relaxation of stamped metal LGA sockets, by testing the actual socket in its final processed form and capturing the effect of the polymer on stress relaxation. Furthermore, by testing small pieces of the socket, independent of the loading assembly, a method of studying the temperature and load dependence of stress relaxation and the effect on the socket's electrical behavior was demonstrated, without the need for system level testing.

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Assessing the operating reliability of land grid array elastomer sockets

Cited by 15 publications

References 7 publications

Multiphysics Analysis and Optimal Design of Compressible Micro-Interconnect for 2.5D/3D Heterogeneous Integration

Multiphysics Analysis and Optimal Design of Compressible Micro-Interconnect for 2.5D/3D Heterogeneous Integration

An investigation of the mechanical behavior of conductive elastomer interconnects

Stress relaxation in a commercial stamped metal land grid array socket

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