2018
DOI: 10.1007/s41635-018-0052-3
|View full text |Cite
|
Sign up to set email alerts
|

Assessment of a Chip Backside Protection

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

0
4
0

Year Published

2019
2019
2024
2024

Publication Types

Select...
3
3
2

Relationship

0
8

Authors

Journals

citations
Cited by 26 publications
(4 citation statements)
references
References 7 publications
0
4
0
Order By: Relevance
“…However, a solely passive layer could be easily removed by polishing. As evaluated in [14], the integrity of the coating layer can be assured by in-silicon light emitters and sensors. This combines an obstruction approach (first category) with an active detection countermeasure (second category).…”
Section: Discussionmentioning
confidence: 99%
“…However, a solely passive layer could be easily removed by polishing. As evaluated in [14], the integrity of the coating layer can be assured by in-silicon light emitters and sensors. This combines an obstruction approach (first category) with an active detection countermeasure (second category).…”
Section: Discussionmentioning
confidence: 99%
“…The foremost requirement for our attack approach to succeed is access through the chip's backside. Active backside coatings [56] can prevent the optical access to the chip's silicon by adding an opaque coating layer. By actively checking the intactness of the coating, attempts to remove it can be detected.…”
Section: Potential Countermeasuresmentioning
confidence: 99%
“…Adding an active opaque layer can be another countermeasure against optical probing. Implementing an active monitoring scheme is required to detect the removal of such opaque layer by an adversary [78]. Since the optical beam stimulates the silicon active regions thermally, conventional photosensors fail to trigger during optical probing.…”
Section: Defense Against Contactless Probingmentioning
confidence: 99%