2010
DOI: 10.5762/kais.2010.11.4.1210
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Assessment of Design and Mechanical Characteristics of MEMS Probe Tip with Fine Pitch

Abstract: The probe card are test modules which are to classify the good semiconductor chips and thin film before the packaging process. In the rapid growth a technology of semiconductor, the number of pads per unit area is increasing and pad arrays are becoming irregular. Therefore, the technology of probe card needs narrow width and lots of probe tip. In this paper, the probe tip based on the MEMS(Micro Electro Mechanical System)technology was developed a new MEMS probe tip for vertical probe card applications. For th… Show more

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Cited by 5 publications
(4 citation statements)
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“…Researchers have used finite element software to simulate and study the mechanical and structural properties of probes, such as needle stiffness and structural analysis [16][17][18], with the aim of obtaining the optimal geometric design [19,20]. The finite element analysis technique has also been verified experimentally to obtain a new probe with tiny contact loads [21].…”
Section: Introductionmentioning
confidence: 99%
“…Researchers have used finite element software to simulate and study the mechanical and structural properties of probes, such as needle stiffness and structural analysis [16][17][18], with the aim of obtaining the optimal geometric design [19,20]. The finite element analysis technique has also been verified experimentally to obtain a new probe with tiny contact loads [21].…”
Section: Introductionmentioning
confidence: 99%
“…Researchers have used finite element software to simulate and study the mechanical and structural properties of probes, such as needle stiffness and structural analysis [14][15][16], with the aim of obtaining the optimal geometric design [17,18]. The finite element analysis technique has also been verified experimentally to obtain a new probe with tiny contact loads [19].…”
Section: Introductionmentioning
confidence: 99%
“…Recently, semiconductor technology develops to highly integrate and compact. So testing process for semiconductor is also developed [1]. Probe station is test equipment for chips on wafer, using probe tip involved in probe card for testing [2].…”
Section: Introductionmentioning
confidence: 99%