Assessment of NiPdAuAg Leadframe Rough for Delamination Stable in Electronic Packaging for Automotive

Azizan, Suhaimi; Omar, Ghazali

doi:10.1109/icsj47124.2019.8998728

Cited by 6 publications

(2 citation statements)

References 1 publication

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“…These factors will be subjected to the confirmation design of the experiment to test the correlation to the delamination percentage. The delamination percentage has been identified as the output response because it is the source of chemical ingression stated in theory [15]. The test vehicle for this study is a small outline transistor (SOT) with an outline dimension of x mm width x y mm length x z mm height, with a standard copper leadframe and tin plating on the leads.…”

Section: Methodsmentioning

confidence: 99%

Investigation of integrated factors in the occurrence of copper wire bonding corrosion of semiconductor packages

Hamid¹,

Badarisman²,

Jalar

et al. 2022

J. Phys.: Conf. Ser.

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Copper wire bonding has got attracted attention over gold wire bonding due to its lower cost. However, despite many unique aspects and properties of copper wire bonding, corrosion of copper wire bonding has become a point of interest as it leads to the failure of semiconductor packages. Current and future trends and development in miniaturization and multifunction of the semiconductor packages show semiconductor manufacturers to establish good wire bonding with high reliability. However, this trend becomes a significant challenge in respect of corrosion occurrence. Several studies on the corrosion of copper wire bonding; however, there is no considerable study in the integrated factors leading to corrosion. Therefore, this paper focuses on investigating the corrosion phenomena of wire copper wire bonding, especially wedge bonds. This paper use a combination of the problem-solving approach for a complex problem. The analysis suggested that the weightage of factors, depending on process parameters and process steps, play a particular role in facilitating or preventing corrosion on the copper wire bonding. Therefore, it is essential to consider these factors when designing assembly process steps and parameters to control corrosion in semiconductor packages.

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Section: Methodsmentioning

confidence: 99%

Investigation of integrated factors in the occurrence of copper wire bonding corrosion of semiconductor packages

Hamid¹,

Badarisman²,

Jalar

et al. 2022

J. Phys.: Conf. Ser.

View full text Add to dashboard Cite

show abstract

“…The reliability assessment [26] was based on AEC-Q100 (Automotive Electronics Council) Grade 0 reliability tier including the moisture sensitivity level 1 (MSL-1), un-bias high accelerated stress…”

Section: Methodsmentioning

confidence: 99%

Effect of Epoxy Molding Compound Material and Roughness Leadframe to Integrated Circuit Package for Automotive Devices

2020

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This research studied about an effect of epoxy molding compound material and roughness leadframe of integrated circuit package for automotive device. In manufacturing process, the epoxy molding compound material and leadframe roughness are main factors that effect to coefficient of thermal expansion (CTE) and reliability for automotive device package with no delamination in high temperature application. In experiment, two types of epoxy molding compound materials were studied and compared between standard and roughened leadframe for quad flat non lead (QFN) package. For reliability test, the epoxy molding compound materials type A and type B with different leadframe were analyzed with moisture sensitivity level 1 to observe delamination inside packages. The results showed that CTE of epoxy molding compound material type A is less CTE mismatch than that of epoxy molding compound material type B with both standard and roughness leadframe. Moreover, the results also found no delamination for epoxy molding compound material type A with roughened leadframe. In addition, both epoxy molding compound materials showed significant delamination inside packages with standard leadframe.

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Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages

Shih,

Liu,

Lin

et al. 2023

Exp Tech

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Assessment of NiPdAuAg Leadframe Rough for Delamination Stable in Electronic Packaging for Automotive

Cited by 6 publications

References 1 publication

Investigation of integrated factors in the occurrence of copper wire bonding corrosion of semiconductor packages

Investigation of integrated factors in the occurrence of copper wire bonding corrosion of semiconductor packages

Effect of Epoxy Molding Compound Material and Roughness Leadframe to Integrated Circuit Package for Automotive Devices

Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages

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