Effect of Epoxy Molding Compound Material and Roughness Leadframe to Integrated Circuit Package for Automotive Devices

Quad Flat No Lead (QFN) is part of an integrated circuit (IC) products that required wire bonding and molding as part of its packaging process. There are many types of QFN packages thickness available in the market and 0.75 mm thickness is one of the highest in demand. The wireless (WLSS) QFN package was used in this research for the mobility of electronics devices especially for wireless technology such as mobile phone and laptop. The objective of this paper is to study the effect of molding cure time at 100 and 130 s of WLSS QFN package. Besides, two variations of package size of 2.5 mm x 2.5 mm and 7.0 mm x 7.0 mm were undergoing each process in QFN packaging stages to adhere to the real manufacturing environment. For characterization, 4 types of QFN package were examined for its moldability through C-CSAM, reliability and electrical test were also carried out according to the Joint Electron Device Engineering Council (JEDEC) requirements. From the result, it was found that the optimum molding cure time is 100 s is suitable for molding the WLSS QFN package. This new curing temperature can be can increase productivity for about 8% for QFN packaging.

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Effect of Molding Cure Time on High Density Quad-Flat-No Lead Sawn Package

Jalal

Ansari

Atiqah

2021

IOP Conf. Ser.: Mater. Sci. Eng.

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Influence of Textured Nickel/Palladium/Gold-Silver (Ni/Pd/Au-Ag) Layer on Pre-plated Leadframe for Automotive Applications

Suhaimi

Omar

Asmah

2021

IOP Conf. Ser.: Mater. Sci. Eng.

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High quality and reliability of integrated circuit packaging is required for automotive applications due to the safety concerns. Therefore, elimination and controlling the package defects which can lead to reliability failure is essential. One of the defects that leads to reliability issue is delamination. This study presents the influence of textured leadframe surfaces on the surface wettability and delamination occurrence in automotive package unit. Standard bare Cu leadframe was used as comparison. The leadframe surface was textured with Ni/Pd/Au-Ag using electroplating technique. The surface morphologies of both bare and textured leadframe were characterized using field-emission scanning electron microscope and optical profiler. The energy dispersive spectroscopy was used to quantify the elemental composition of the samples. All samples went through the wettability test under two conditions, which were room temperature and 175°C. The reliability test of complete package was subjected to moisture sensitivity preconditioning level 1 according to IPC/JEDEC STD 020 and the baking process was performed at 125°C for 24hrs followed by soaking process under the condition of 85°C and 85 of relative humidity. Scanning acoustic tomography according to IPC/JEDEC STD 035 was performed after three cycles of infrared reflow at 260°C. Higher surface roughness was observed for pre-plated leadframe (PPF) compared with bare leadframe. The lowest value of average contact angle (∼55°) was observed for PPF at 175°C indicated better wettability feature. Furthermore, no delamination occurrence was observed for PPF sample compared with bare copper leadframe. The obtained result reveals that leadframe with textured surface of Ni/Pd/Au-Ag improved interfacial surface adhesion which eliminated the delamination defect and thus improved the package robustness and reliability.

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Effect of Epoxy Molding Compound Material and Roughness Leadframe to Integrated Circuit Package for Automotive Devices

Cited by 2 publications

References 20 publications

Effect of Molding Cure Time on High Density Quad-Flat-No Lead Sawn Package

Effect of Molding Cure Time on High Density Quad-Flat-No Lead Sawn Package

Influence of Textured Nickel/Palladium/Gold-Silver (Ni/Pd/Au-Ag) Layer on Pre-plated Leadframe for Automotive Applications

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