Comprehensive Semiconductor Science and Technology 2011
DOI: 10.1016/b978-0-44-453153-7.00110-3
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Assessment of Semiconductors by Scanning Electron Microscopy Techniques

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Cited by 5 publications
(2 citation statements)
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“…The electrical and optical properties of the dislocations and created stacking faults (SFs) in the contaminated specimens were simultaneously studied by using EBIC and CL modes of a scanning electron microscope (SEM; Hitachi S4200) at room temperature. 11,12) The accelerating voltage and electron-beam (e-beam) current were 20 kV and 3 nA, respectively. The recombination activity of a defect is evaluated from its EBIC contrast that is defined by…”
Section: Methodsmentioning
confidence: 99%
“…The electrical and optical properties of the dislocations and created stacking faults (SFs) in the contaminated specimens were simultaneously studied by using EBIC and CL modes of a scanning electron microscope (SEM; Hitachi S4200) at room temperature. 11,12) The accelerating voltage and electron-beam (e-beam) current were 20 kV and 3 nA, respectively. The recombination activity of a defect is evaluated from its EBIC contrast that is defined by…”
Section: Methodsmentioning
confidence: 99%
“…The sample generates secondary electrons due to low energy and inelastic interactions with the beam and is primarily used for topographic inspection. In contrast, backscattered imaging results from incident electrons deflected away from “heavier elements,” providing crystalline and magnetic field information 12 , 13 . A detector captures these signals to produce topographical and morphological data to visualize cellular structures.…”
Section: Introductionmentioning
confidence: 99%