Asymptotic Analysis of the Thermal Stresses in a Two-Layer Composite With an Adhesive Layer

Williams, Harry E.

doi:10.1080/01495738508942229

Cited by 26 publications

(4 citation statements)

References 5 publications

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“…The analysis was based on two-dimensional elasticity theory and the variational theorem of complementary energy presented by Washizu [26] under the assumption of linear distribution of longitudinal normal strain through the thickness of each layer. A similar approach was applied by Williams [30] and showed good agreement with the results of Chen et al [7]. Bogy [5], [6], Hein and Erdogan [11] and Yin [31] discussed stress singularities at the bimaterial interfaces near the free edges.…”

Section: Introductionsupporting

confidence: 67%

Analysis of Multilayered Microelectronic Packaging Under Thermal Gradient Loading

Basaran

Wen

2006

IEEE Trans. Comp. Packag. Technol.

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An accurate estimation of interfacial and axial stresses in multilayered structures is important in the design process of microelectronic packaging because these stresses drive the failure modes in the package. During manufacturing, microelectronic packaging devices usually suffer from severe thermal gradients. Design engineers often simplify the thermal gradient case as an isothermal loading case by averaging the temperature of the top and bottom of the microelectronic packaging device. Such simplification usually underestimates the stress level in the devices. With the analytical model presented in this paper, the stresses in multilayered microelectronic packaging devices subjected to thermal gradient loading can easily be predicted. It is shown that ignoring the thermal gradient in the package leads to underestimation of stresses.

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Section: Introductionsupporting

confidence: 67%

Analysis of Multilayered Microelectronic Packaging Under Thermal Gradient Loading

Basaran

Wen

2006

IEEE Trans. Comp. Packag. Technol.

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“…The analysis was based on twodimensional elasticity theory and the variational theorem of complementary energy (Washizu, 1968) under the assumption of linear distribution of longitudinal normal strain through the thickness of each layer. A similar approach was applied by Williams (1985) and showed good agreement with Chen et al (1982). Bogy (1968Bogy ( , 1970, Hein and Erdogan (1971) and Yin (1991) discussed stress singularities at the interfaces near the free edges.…”

Section: Introductionmentioning

confidence: 79%

Analysis of multi-layered microelectronic packaging under uniformly distributed loading

Wen

Basaran

2003

International Journal of Solids and Structures

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“…lative stiffness of the substrate and film [25], a martensitic transformation on a substrate with finite stiffness poses an even more complicated problem. Both factors, martensitic transformation and substrate stiffness, introduce heterogeneous structures which are substantially more complicate than those numerically solved before.…”

Section: ~Sults and Discussionmentioning

confidence: 99%

Thermomechanical and martensitic transformation stresses of NiTiJSi thin film composites

Kim¹,

Roytburd

Su³

et al. 1997

Metals and Materials

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The thermomechanical properties of Nis~Tis~ deposited on Si substrates was studied focusing on the thermoelastic stress, martensitic transformation stress and interaction of the film and substrate. Nis,)TisJSiOffSi film composites display a two-way shape memory effect without training. The stresses giving rise to this effect are the thermoelastic stress evolving upon cooling from the temperature at which the amorphous as-deposited Ni~oTis, was crystallized and martensitic transformation stress. It is shown how the thermoelastic bending can be compensated for in a (crystalline NisoTiso)/SiOz/Si/(amorphous Nis~,Tis~j) trimorph. The experimentally determined temperature dependence of the stress outside the transformation region agrees with the calculated value of the thermoelastic stress; in the vicinity of the Ms and Af temperatures, which are equal to each other, it also agrees with the theoretical prediction based on the equilibrium thermodynamics of the sum of the film, substrate and film/substrate elastic (interaction) energies. The film/substrate interaction energy is derived from martensitic transformation characteristics through interface accommodation and mechanical constraints exerted by the substrate stiffness. This knowledge has been applied Io fabricate a two way shape memory micro composite switch.

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Asymptotic Analysis of the Thermal Stresses in a Two-Layer Composite With an Adhesive Layer

Cited by 26 publications

References 5 publications

Analysis of Multilayered Microelectronic Packaging Under Thermal Gradient Loading

Analysis of Multilayered Microelectronic Packaging Under Thermal Gradient Loading

Analysis of multi-layered microelectronic packaging under uniformly distributed loading

Thermomechanical and martensitic transformation stresses of NiTiJSi thin film composites

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