Atomic scale characterization of deformation-induced interfacial mixing in a Cu/V nanocomposite wire

Abstract

The microstructure of a Cu/V nanocomposite wire processed by cold drawing was investigated by high resolution transmission electron microscopy and atom probe tomography. The experimental data clearly reveal some deformation induced interfacial mixing where the vanadium filaments are nanoscaled. The mixed layer is a 2nm wide vanadium gradient in the fcc Cu phase. This mechanical mixing leads to the local fragmentation and dissolution of the filaments and to the formation of vanadium super saturated solid solutions in fcc Cu. Published by Elsevier Ltd (www.elsevier.com/locate/scriptam at)

Grain boundaries in ultrafine grained materials processed by severe plastic deformation and related phenomena

“…Thus, phase transformations may occur, leading to the decomposition of second phase particles and the vanishing of heterophase interfaces. It also introduces supersaturation of alloying elements and thus brings about significant hardening by solid solution [100][101][102]. Such features were reported in steels where Fe 3 C carbides were dissolved after HPT [58,103,104] but also in FeNi alloys [105,106] processed by HPT or in an Al-Cu alloy processed by ECAP [78,107].…”

Melting Behavior of Al/Pb/Sn/Al Multilayered Thin Films

“…However, Al diffusing into Pb and Sn is mainly due to SPD. It is to be noted that there are reports in the literature of deformation-induced intermixing of immiscible metals such as Cu-V, [29] Fe-Cu, [29] Cu-Co, [30] etc. EPMA results reveal that substantial amount of Al (20 to 25 at.…”

Microstructure and fatigue strength of high-strength Cu–Fe and Cu–V in-situ nanocomposite wires

“…In recent three decades, binary in-situ nanocomposite conductors based on metal copper matrix with bcc metal additions, namely, Cu-Nb, Cu-V, Cu-Fe, Cu-Cr, Cu-Ta, Cu-W are the subject of intensive research [1][2][3][4][5][6][7][8][9][10][11][12].…”

“…as additives influences the characteristics of structure, conductivity, mechanical properties and cost of the wires. Sauvage et al [7] showed that the heavily deformed Cu-V composite exhibits in general the typical microstructure consisting from the curled V filaments rather uniformly distributed in the Cu matrix as for much more extensively investigated Cu-Nb composite wires [14]. The V filaments are continuously elongated during the drawing process and the interface areas also increase and the global amount of V in solid solution increases.…”