Microstructure and fatigue strength of high-strength Cu–Fe and Cu–V in-situ nanocomposite wires

Nikulin, S.; Рогачев, С. О.; Рожнов, А. Б.; Pantsyrnyi, V. I.; Khlebova, N. E.; Nechaykina, T.A.; Хаткевич, В. М.; Zadorozhnyy, M.Yu.

doi:10.1016/j.compositesb.2014.10.046

Cited by 9 publications

(5 citation statements)

References 20 publications

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“…Cu-Fe in-situ composites have a high conductivity, high strength, and low cost [1][2][3][4][5][6]. However, their strength and conductivity are decreased by the substantial solid solubility of Fe atoms in the Cu matrix at high temperatures, and the slow precipitation speed at low temperatures [7,8].…”

Section: Introductionmentioning

confidence: 99%

“…This paper studies the tensile strength evolution and strengthening mechanism of Cu-Fe in-situ composites using both experiments and theoretical analysis. The experimental aims were (1) to understand the strength increase with the increasing strain and (2) to establish the strengthening mechanisms. The novelty of the research is the new mathematical model for the increase of strength with increasing the cold deformation strain, based on these experiments and theoretical analysis.…”

Section: Introductionmentioning

confidence: 99%

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Microstructure and Strengthening Model of Cu–Fe In-Situ Composites

Liu

Sheng

et al. 2020

Materials

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The tensile strength evolution and strengthening mechanism of Cu–Fe in-situ composites were investigated using both experiments and theoretical analysis. Experimentally, the tensile strength evolution of the in-situ composites with a cold deformation strain was studied using the model alloys Cu–11Fe, Cu–14Fe, and Cu–17Fe, and the effect of the strain on the matrix of the in-situ composites was studied using the model alloys Cu–3Fe and Cu–4.3Fe. The tensile strength was related to the microstructure and to the theoretical strengthening mechanisms. Based on these experimental data and theoretical insights, a mathematical model was established for the dependence of the tensile strength on the cold deformation strain. For low cold deformation strains, the strengthening mechanism was mainly work hardening, solid solution, and precipitation strengthening. Tensile strength can be estimated using an improved rule of mixtures. For high cold deformation strains, the strengthening mechanism was mainly filament strengthening. Tensile strength can be estimated using an improved Hall–Petch relation.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Microstructure and Strengthening Model of Cu–Fe In-Situ Composites

Liu

Sheng

et al. 2020

Materials

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“…Therefore, V was chosen to enhance copper matrix in this study. Unfortunately, few studies on Cu–V alloy have been reported and most of these researches mainly focus on the Cu–V alloy wire by cold drawing and Cu–V multilayer films [16,17,18,19]. The vanadium fibre reinforced copper matrix wire presents very high strength, but like the Nb and Ag fibre, the V fibre would be divided and spheroidality, which could cause a sharply drop in strength.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Enhanced Properties of Copper-Vanadium Nanocomposites Obtained by Powder Metallurgy

Wang

Zou

et al. 2019

Materials

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Cu-2.4 wt.%V nanocomposite has been prepared by mechanical alloy and vacuum hot-pressed sintering technology. The composites were sintered at 800 °C, 850 °C, 900 °C, and 950 °C respectively. The microstructure and properties of composites were investigated. The results show that the Cu-2.4 wt.%V composite presents high strength and high electrical conductivity. The composite sintered at 900 °C has a microhardness of 205 HV, a yield strength of 404.41 MPa, and an electrical conductivity of 79.5% International Annealed Copper Standard (IACS); the microhardness and yield strength reduce gradually with the increasing consolidation temperature, which is mainly due to the growth of copper grain size. After sintering, copper grain size and V nanoparticle both maintain in nanoscale; the strengthening mechanism is related to grain boundary strengthening and dispersion strengthening, while the grain boundary strengthening mechanism plays the most important role. This study indicates that the addition of small amounts of V element could enhance the copper matrix markedly with the little sacrifice of electrical conductivity.

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“…Cu-13wt%V composite wires showed precipitation (592 ± 37 nm in length and 29.0 ± 0.9 nm in thickness) in the cold drawn (η = 7–9) wires with intermediate annealing at temperature ranges of 350–500 °C. 29 When compared with the Cu-14%Fe, V has very low solubility in the Cu (0.6% at 1000 °C compared to 4% for Fe), which causes more precipitation corresponding to such heat treatments. Figure 9 shows the precipitates formed during solidification of Cu-Fe 88 and Cu-Ag 41 for reference.…”

Section: Microstructurementioning

confidence: 99%

“…Desired concentrations of matrix and strengthening metals are mixed and melted usually in an inert environment in furnaces of various types such as induction furnaces, 2,17,25,26 Tammann furnaces, 27 or arc melting furnaces. [28][29][30][31] Table 1 encompasses processing details and introductory information about the studies in which cast-and-deform technique was incorporated.…”

Section: Cast-and-deform In-situ Techniquementioning

confidence: 99%

Deformation processed high strength high conductivity Cu and Al matrix composite wires: An introductory review

Zafar

Nair

2022

Proceedings of the Institution of Mechanical Engineers, Part L:

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Deformation processed wires are used in the fields which demand the combination of contradictory properties such as mechanical strength and electrical conductivity. For the last 4–5 decades, scientists have focused on fabricating Cu and Al matrix wires using various plastic deformation techniques. While the high electrical conductivity is ensured through mentioned elements, the strength is achieved by orderly employment of plastic deformation and various heat treatments for basically achieving microscale filamentary structure of reinforcing elements. However, the strict selection criteria of starting materials and contradicting nature of processing regime and expected properties require proper knowledge of materials-microstructure and fabrication-property correlations. This paper summarizes the manufacturing methods, processing parameters-microstructure interactions, consequential mechanical and electrical properties and finally, current, and potential applications of deformation processed bi-metallic composite wires. It will help engineers, through provided comparative analysis, choose appropriate processing routes and starting materials for the realization of high strength/conductivity wires as well as guide what to expect in terms of targeted properties.

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Microstructure and fatigue strength of high-strength Cu–Fe and Cu–V in-situ nanocomposite wires

Cited by 9 publications

References 20 publications

Microstructure and Strengthening Model of Cu–Fe In-Situ Composites

Microstructure and Strengthening Model of Cu–Fe In-Situ Composites

Microstructure and Enhanced Properties of Copper-Vanadium Nanocomposites Obtained by Powder Metallurgy

Deformation processed high strength high conductivity Cu and Al matrix composite wires: An introductory review

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