Attaining Single-Chip, High-Performance Computing through 3D Systems with Active Cooling

Coskun, Ayse K.; Meng, Jie; Atienza, David; Sabry, Mohamed M.

doi:10.1109/mm.2011.39

Cited by 16 publications

(8 citation statements)

References 21 publications

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“…The control/optimization policies in the MANGO resource management will be able to evaluate the QoS and non-functional requirements of the applications, in a hierarchical, system-wide multi-objective optimization going beyond electronics to mechanical aspects (e.g., liquid cooling pump control) [18]. The collected information from monitors enables the prediction of temperatures in the different parts of the servers and racks, which will be passed to the hierarchic runtime manager, structured in a hierarchical architecture exploiting both OS and hypervisor levels, which will be able to tune the system knobs (Pstates, fan control, tasks assignments, etc.…”

Section: Programming Model and Runtime Managementmentioning

confidence: 99%

Enabling HPC for QoS-sensitive Applications: The MANGO Approach

Flich

Agosta

Ampletzer³

et al. 2016

Proceedings of the 2016 Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition (DATE)

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Abstract-In this paper, we provide an overview of the MANGO project and its goal. The MANGO project aims at addressing power, performance and predictability (the PPP space) in future High-Performance Computing systems. It starts from the fundamental intuition that effective techniques for all three goals ultimately rely on customization to adapt the computing resources to reach the desired Quality of Service (QoS). From this starting point, MANGO will explore different but interrelated mechanisms at various architectural levels, as well as at the level of the system software. In particular, to explore a new positioning across the PPP space, MANGO will investigate system-wide, holistic, proactive thermal and power management aimed at extreme-scale energy efficiency.

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Section: Programming Model and Runtime Managementmentioning

confidence: 99%

Enabling HPC for QoS-sensitive Applications: The MANGO Approach

Flich

Agosta

Ampletzer³

et al. 2016

Proceedings of the 2016 Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition (DATE)

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“…Furthermore, 3D integration enables easier development of heterogeneous computing architectures because it is possible to integrate multiple memory types (e.g., 3D-stacked DRAM, phase change memory), and storage (e.g., solid-state disk) devices from different manufacturing processes, as in the EuroCloud server project [13]. However, as a side effect, power density is expected to significantly increase in 3D multi-core computing systems (i.e., up to 300 W/cm 3 [14]), which will make extremely difficult to properly dissipate the generated heat with current air-based cooling systems [15]. In particular, if free cooling is used, it will be a must to consider jointly the conception of the cooling and computing architecture.…”

Section: ) Energy-proportional Server Designsmentioning

confidence: 99%

Power-Thermal Modeling and Control of Energy-Efficient Servers and Datacenters

Kim

Sabry

Ruggiero

et al. 2015

Handbook on Data Centers

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“…3) While our proposal is a design-time technique, thus complementary to run-time thermal management strategies, it handles the thermal gradient reduction more efficiently compared to run-time techniques. As our technique optimizes the tradeoff between pumping power and thermal gradients [5], [6], it helps achieve more efficient thermal management.…”

Section: Design-time Optimization For Liquid-cooled 3-d Mpsocsmentioning

confidence: 99%

“…High-performance 3-D MPSoCs include a large number of processor cores in close proximity. Such high power densities, combined with the reduced cooling efficiency for the layers away from the cooling subsystem (e.g., heat sinks and fans), aggravate the existing temperature-induced problems [5].…”

mentioning

confidence: 99%

“…Recent research has demonstrated that applying thermal management techniques designed for planar 2-D ICs to 3-D systems is suboptimal for meeting desired performance-temperature-energy requirements [14], [15]. While recent work has also developed thermal management policies for liquid-cooled 3-D systems [5], [6], [16], [17], these policies do not address the thermal gradients along the microchannels.…”

mentioning

confidence: 99%

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GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation

Sabry¹,

Sridhar²,

Meng

et al. 2013

IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

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Abstract-Liquid cooling using interlayer microchannels has appeared as a viable and scalable packaging technology for 3-D multiprocessor system-on-chips (MPSoCs). Microchannelbased liquid cooling, however, can substantially increase the onchip thermal gradients, which are undesirable for reliability, performance, and cooling efficiency. In this paper, we present GreenCool, an optimal design methodology for liquid-cooled 3-D MPSoCs. GreenCool simultaneously minimizes the cooling energy for a given system while maintaining thermal gradients and peak temperatures under safe limits. This is accomplished by tuning the heat transfer characteristics of the microchannels using channel width modulation. Channel width modulation is compatible with the current process technologies and incurs minimal additional fabrication costs. Through an extensive set of experiments, we show that channel width modulation is capable of complementing and enhancing the benefits of temperatureaware floorplanning. We also experiment with a 16-core 3-D system with stacked dynamic random-access memory, for which GreenCool improves energy efficiency by up to 53% with respect to no channel modulation.

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Attaining Single-Chip, High-Performance Computing through 3D Systems with Active Cooling

Cited by 16 publications

References 21 publications

Enabling HPC for QoS-sensitive Applications: The MANGO Approach

Enabling HPC for QoS-sensitive Applications: The MANGO Approach

Power-Thermal Modeling and Control of Energy-Efficient Servers and Datacenters

GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation

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