Automated Calibration of RF On-Wafer Probing and Evaluation of Probe Misalignment Effects Using a  Desktop Micro-Factory

Microrobotics, F. T. von Kleist-Retzow$Division; Oldenburg, Johannes

doi:10.4236/jcc.2016.43009

Cited by 13 publications

(1 citation statement)

References 15 publications

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“…One of these challenges is an understanding of the link between the positioning of such probes and their inherent mechanical flexibility. This is particularly important in terms of the impact of positional errors on optimum electrical contact [6]; something that has been studied in rigid commercial probes [7][8][9][10][11][12][13][14]. In contrast, the micromechanical behaviour (bending and twisting) of miniature microcantilever-based probes must be taken into account for optimum probe contacting [15][16][17].…”

Section: Introductionmentioning

confidence: 99%

Tilt-related alignment issues in miniature micromechanical on-wafer electrical probes composed of multiple flexible microcantilevers

Arscott

2024

Eng. Res. Express

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Some new issues concerning the contacting and positioning of small electrical microelectromechanical systems (MEMS) probes based on multiple, flexible microcantilevers are presented here. A tilt error, associated with the lateral probe roll, means that contact touchdown occurs sequentially in different cantilevers upon increasing probe overtravel. To understand the relationship between probe overtravel, tip skate, tip planarity, tip tangency, and contact force in the different contacts, the relationship between mechanical bending and torsion of the flexible cantilevers needs to be accounted for. The study reveals the conditions for achieving contact planarity and desired contact force, as well as the identification of a new ‘differential skate error’ contact misalignment associated with such MEMS probes based on multiple, flexible microcantilevers. This misalignment leads to a ‘differential contact force error’ which has implications for electrical contact quality. An experimental scale model probe based on three cantilevers is used to test the modelling—the results agree well with the predictions of the model. Interestingly, the experiments revealed an effect not accounted for in the modelling; this ‘twist error’ resulted in the cantilever lead edge not being parallel to the touchdown plane. The findings may be useful for engineers involved with the automatic control positioning of such emerging miniature probes, especially in terms of the impact of probe positioning errors.

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Section: Introductionmentioning

confidence: 99%

Tilt-related alignment issues in miniature micromechanical on-wafer electrical probes composed of multiple flexible microcantilevers

Arscott

2024

Eng. Res. Express

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RF wafer probing with improved contact repeatability using nanometer positioning

Daffe

Dambrine

Kleist-Retzow

et al. 2016

2016 87th ARFTG Microwave Measurement Conference (ARFTG)

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This paper presents an improved technique for monitoring and controlling the contact condition of on-wafer RF probes with nanometer accuracy to enhance the measurement repeatability. The setup consists of a vector network analyzer, a modified probe station with a planar calibration substrate aligned under microwave GSG probe through a closed-loop nanopositioner and a camera system. A fully one-port SOL calibration is performed in the frequency range 0.05-50 GHz. A repeatability study based on standard deviations of the measured data considering both conventional and proposed approaches is described. From these experimental results, the improvement of the technique proposed is achieved by accurately controlling the probe contacts.

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Accuracy Improvement of On-wafer Measurement at Millimeter-wave Frequency by a Full-automatic RF probe-tip Alignment Technique

Sakamaki

Horibe

2018

2018 91st ARFTG Microwave Measurement Conference (ARFTG)

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Automated Calibration of RF On-Wafer Probing and Evaluation of Probe Misalignment Effects Using a Desktop Micro-Factory

Cited by 13 publications

References 15 publications

Tilt-related alignment issues in miniature micromechanical on-wafer electrical probes composed of multiple flexible microcantilevers

Tilt-related alignment issues in miniature micromechanical on-wafer electrical probes composed of multiple flexible microcantilevers

RF wafer probing with improved contact repeatability using nanometer positioning

Accuracy Improvement of On-wafer Measurement at Millimeter-wave Frequency by a Full-automatic RF probe-tip Alignment Technique

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