Automated Die Inking

Statistical wafer-level characteristic variation modeling offers an attractive method for reducing the measurement cost in large-scale integrated (LSI) circuit testing while maintaining test quality. In this method, the performance of unmeasured LSI circuits fabricated on a wafer is statistically predicted based on a few measured LSI circuits. Conventional statistical methods model spatially smooth variations in the wafers. However, actual wafers can exhibit discontinuous variations that are systematically caused by the manufacturing environment, such as shot dependence. In this paper, we propose a modeling method that considers discontinuous variations in wafer characteristics by applying the knowledge of manufacturing engineers to a model estimated using Gaussian process regression. In the proposed method, the process variation is decomposed into systematic discontinuous and global components to improve estimation accuracy. An evaluation performed using an industrial production test dataset indicates that the proposed method effectively reduces the estimation error for an entire wafer by over 36% compared with conventional methods.

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“…However, as shown in Fig. 1, other components that are systematically caused by manufacturing equipment are frequently observed [18], [19].…”

Section: Systematic Discontinuous Effect Caused By Manufacturing Envi...mentioning

confidence: 96%

Wafer-Level Characteristic Variation Modeling Considering Systematic Discontinuous Effects

Nagao

NAKAMURA

Kajiyama

et al. 2024

IEICE Trans. Fundamentals

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“…So, the design was structured based on the cotton and yarn material which supports to performance of tie and dye mechanisms [2]. Dyeing is the process of mixing different categories of chemicals together so that a chemical bond prevails between dye and fabric.…”

Section: Introductionmentioning

confidence: 99%

IoT Based Compact, Low-Cost Dyeing Machine for Medium Scale Industrial Environment Applications

L¹,

M²,

Kavitha³

et al. 2023

Preprint

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Colouring clothes use the universal solvent “water” whose Potential of Hydrogen (pH) level is increased when combined with the chemical colouring agents. The proposed design is an innovation that uses centre sprinkler rod which supports to spread of the colour evenly all over the cloth. Arduino board helps in combining water and provisional colour as per the programmed mechanism. Ultrasonic sensor measures the range to which mixed colour must be filled in the container. Arduino board interconnected with ultrasonic sensor helps in operating the sprinkler rod, which supports for the even spread of dye all over the cloth. Even spread of dyes, lever mechanism is used to dip the cloth inside the container with the dyeing solution. The process will be repeated further for a pre-defined duration of time, based on the material of the cloth. After the process, the dyeing solution in the container is allowed to discharge. The pH sensor placed at the outlet will test the pH and will lead to a zero discharge water container. These zero dis-charge water containers incorporate the filtering process where the pH level of the water is reduced. This designed embedded device helps the lower middle-class people economically. The idea of protecting people is the first criterion met up with the designed product. Thus, this idea helps people to run a smooth lifestyle both in terms of money and health. Also, this designed device helps in retaining and reusing water for various other applications.

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Wafer-level Adaptive Testing Based on Dual-Predictor Collaborative Decision

Pan,

Liang,

et al. 2024

J Electron Test

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Automated Die Inking

Cited by 12 publications

References 27 publications

Wafer-Level Characteristic Variation Modeling Considering Systematic Discontinuous Effects

Wafer-Level Characteristic Variation Modeling Considering Systematic Discontinuous Effects

IoT Based Compact, Low-Cost Dyeing Machine for Medium Scale Industrial Environment Applications

Wafer-level Adaptive Testing Based on Dual-Predictor Collaborative Decision

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