2017 IEEE International Test Conference (ITC) 2017
DOI: 10.1109/test.2017.8242040
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Automated die inking: A pattern recognition-based approach

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Cited by 9 publications
(2 citation statements)
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“…Burn‐in tests are also generally applied for detecting such latent defects. However, burn‐in tests are prohibitive because of the cost and the complexity involved (Xanthopoulos, Sarson, Reiter, & Makris, 2017). A method to automate this process using ML has been reported in Xanthopoulos et al (2017).…”
Section: Yield Learning and Diagnosismentioning
confidence: 99%
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“…Burn‐in tests are also generally applied for detecting such latent defects. However, burn‐in tests are prohibitive because of the cost and the complexity involved (Xanthopoulos, Sarson, Reiter, & Makris, 2017). A method to automate this process using ML has been reported in Xanthopoulos et al (2017).…”
Section: Yield Learning and Diagnosismentioning
confidence: 99%
“…However, burn‐in tests are prohibitive because of the cost and the complexity involved (Xanthopoulos, Sarson, Reiter, & Makris, 2017). A method to automate this process using ML has been reported in Xanthopoulos et al (2017). Faulty dies, which are close to defective clusters in a wafer, are inked manually while training the model.…”
Section: Yield Learning and Diagnosismentioning
confidence: 99%