Automated measurement setup for ku band mmic characterization

Kamenopolsky, S.; Dankov, Plamen I.

doi:10.1109/arftgs.2002.1214692

Cited by 2 publications

(1 citation statement)

References 3 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…However, this leads to laborious operation, poor accuracy, and low speed. Traditional systems also ignore vector error correction, electromagnetic interference, temperature drift, and so on [9][10][11][12][13][14][15]. They cannot meet the precision and speed requirement of today's 5G communication, radars, safety inspection, and other mm-wave applications.…”

Section: Introductionmentioning

confidence: 99%

All-in-One Wafer-Level Solution for MMIC Automatic Testing

et al. 2018

View full text Add to dashboard Cite

In this paper, we present an all-in-one wafer-level solution for MMIC (monolithic microwave integrated circuit) automatic testing. The OSL (open short load) two tier de-embedding, the calibration verification model, the accurate PAE (power added efficiency) testing, and the optimized vector cold source NF (noise figure) measurement techniques are integrated in this solution to improve the measurement accuracy. A dual-core topology formed by an IPC (industrial personal computer) and a VNA (vector network analyzer), and an automatic test software based on a three-level driver architecture, are applied to enhance the test efficiency. The benefit from this solution is that all the data of a MMIC can be achieved in only one contact, which shows state-of-the-art accuracy and efficiency.

show abstract