Automated Virtual Prototyping for Fastest Time-to-Market of New System in Package Solutions

Abstract

A modular system of parametric FE models is created using ANSYS parametric design language (APDL) for automated virtual prototyping of current and future System-in-Package (SiP) solutions based on fan-out-wafer-level-packaging (FOWLP) technologies. The principles of the hierarchical architecture are described and instructive examples are given for all levels, i.e., from the part models to the four demonstrator packages. Further, the results of first simulations addressing the typical load case of temperature cycling between -40°C and 125°C clearly demonstrate the validity of the approach as they agree to the experimental finding. The system of models is now applicable to a large variety of future SiP products based on FOWLP. It will allow virtual prototyping, i.e., replace time consuming experimental tests during the product definition phase. Keywords-System-in-Package (SiP), fan-out wafer level packaging (FOWLP), Parametric FE modelling, thermal cycling (TC), Package on Package (PoP)Family 1 Family 3 Family 2

Assessment of FOWLP process dependent wafer warpage using parametric FE study

“…The process steps for creating the parametric FE model have been outlined in Figure 1 with corresponding example models, which starts by defining the SiP geometry parameters, material properties, element types and real constants. The next parametric area modeling step has been adopted from the fully parametric modular system of models for SiP products based on FOWLP [2]. This step provides flexibility to create FE model for any combination of components like multiple dies, vias and integrated passives in the package.…”