2022
DOI: 10.3390/en15134892
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Automatic Optimization of Input Split and Bias Voltage in Digitally Controlled Dual-Input Doherty RF PAs

Abstract: Digitally controlled Dual-Input Doherty Power Amplifiers (DIDPAs) are becoming increasingly popular due to the flexible input signal splitting between the main and auxiliary stages. Nevertheless, the presence of many degrees of freedom, e.g., input amplitude split and phase displacement as well as biasing for multiple stages, often involves inefficient trial-and-error procedures to reach a suitable PA performance. This article presents automated parameter setting based on coordinate descent or Bayesian optimiz… Show more

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Cited by 11 publications
(8 citation statements)
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“…Figure 11 reports the same plots as Fig. 10 when applying DIDPA linearization, i.e., running both the outer loop in (1) and the inner loop in (2). The performance results in terms of ACPR, EVM, PAE, and average output power are reported in Table I for both cases (with and without linearization).…”
Section: B Didpa Linearizationmentioning
confidence: 95%
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“…Figure 11 reports the same plots as Fig. 10 when applying DIDPA linearization, i.e., running both the outer loop in (1) and the inner loop in (2). The performance results in terms of ACPR, EVM, PAE, and average output power are reported in Table I for both cases (with and without linearization).…”
Section: B Didpa Linearizationmentioning
confidence: 95%
“…This sweep resulted in the input splitting values (α = 1, ϕ = −30 • ), referred as P0 in the following. In order to emulate this splitting behavior across the BW, these conditions are imposed by implementing the inner loop in (2). For this test, the DUT is excited by a random-phase multi-tone input test signal, whose statistics can be shaped to match 5G signals [18].…”
Section: B Didpa Linearizationmentioning
confidence: 99%
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“…CMOS technology has been has attracted significant attention in integrated circuit design due to its low cost of implementation and to achieve the goal of realizing complete system-on-chip (SoC) implementation. CMOS-based PAs have numerous limitations because of their low breakdown voltage, the low-quality factor of passive components, high silicon-substrate loss, and the inaccessibility of back via holes for the ground, in which they restrict the attainable linear output power and efficiency as compared to III-V based PAs such as Gallium Arsenide (GaAs) and Gallium Nitride (GaN)-based PAs [ 1 , 2 , 3 , 4 ]. Myriad performance-improving methods for linearity and efficiency refinement have been implemented for CMOS PAs to address these aforementioned limitations [ 5 , 6 ].…”
Section: Introductionmentioning
confidence: 99%