2022
DOI: 10.1149/2162-8777/ac546e
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B and Ga Co-Doped Si1−xGex for p-Type Source/Drain Contacts

Abstract: Contact resistivity reduction at the source/drain contacts is one of the main requirements for the fabrication of future MOS devices. Current research focuses on methods to increase the active doping concentration near the contact region in silicon-germanium S/D epilayers. A possible approach consists in adding co-dopants during the epitaxy process. In the case of p-MOS, gallium can be used in addition to boron. In this work, the properties of in situ Ga and B co-doped Si0.55Ge0.45 layers are discussed. The su… Show more

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Cited by 2 publications
(1 citation statement)
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“…Gallium is a promising candidate, as it has already been used to fabricate highly doped semiconductor materials showing good contact properties with metals, both as a single dopant (6)(7)(8) and as a co-dopant (9). However, in Si1-xGex deposition, in situ doping normally results in a severe Ga segregation at the epilayer surface (10). Controlling this segregation is necessary to be able to study the physical properties of Ga doping in epitaxial Si1-xGex in view of its usage as a co-dopant.…”
Section: Introductionmentioning
confidence: 99%
“…Gallium is a promising candidate, as it has already been used to fabricate highly doped semiconductor materials showing good contact properties with metals, both as a single dopant (6)(7)(8) and as a co-dopant (9). However, in Si1-xGex deposition, in situ doping normally results in a severe Ga segregation at the epilayer surface (10). Controlling this segregation is necessary to be able to study the physical properties of Ga doping in epitaxial Si1-xGex in view of its usage as a co-dopant.…”
Section: Introductionmentioning
confidence: 99%