2014
DOI: 10.1002/jsid.211
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Back‐channel‐etched thin‐film transistor using c‐axis‐aligned crystal In–Ga–Zn oxide

Abstract: Our crystalline In–Ga–Zn oxide (IGZO) thin film has a c‐axis‐aligned crystal (CAAC) structure and maintains crystallinity even on an amorphous base layer. Although the crystal has c‐axis alignment, its a‐axis and b‐axis have random arrangement; moreover, a clear grain boundary is not observed. We fabricated a back‐channel‐etched thin‐film transistor (TFT) using the CAAC‐IGZO film. Using the CAAC‐IGZO film, more stable TFT characteristics, even with a short channel length, can be obtained, and the instability o… Show more

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Cited by 74 publications
(82 citation statements)
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“…TEM observation of a CAAC-IGZO film shows that pellets arrange in a direction parallel to the surface of the substrate and stack (10). However, our previous study did not clarify how pellets randomly taking off from the target are arranged on the substrate to have c-axis alignment, how they interconnect, and why they are larger than pellets in nc-IGZO and a-like IGZO films in the initial state as shown in Fig.…”
Section: Plan-view Tem Observation Of Caac-igzo Filmmentioning
confidence: 95%
“…TEM observation of a CAAC-IGZO film shows that pellets arrange in a direction parallel to the surface of the substrate and stack (10). However, our previous study did not clarify how pellets randomly taking off from the target are arranged on the substrate to have c-axis alignment, how they interconnect, and why they are larger than pellets in nc-IGZO and a-like IGZO films in the initial state as shown in Fig.…”
Section: Plan-view Tem Observation Of Caac-igzo Filmmentioning
confidence: 95%
“…8(c)], leaving only the permeable SiO x covering the channel region. Conventionally, the making of an inverted staggered TFT with a bottom gate [1], [16] resulted in an undesirable but inevitable etching of the back channel. This etching could only be prevented by the formation and patterning of an etch-stop layer [21].…”
Section: Igzo Tfts With Annealing-induced Conductive S/d Regionsmentioning
confidence: 99%
“…The SiN y layer is subsequently patterned so that it is removed from the channel region. The underlying SiO x layer, which need not be patterned, acts like an inherent back-channel etch-stop and prevents the channel region from the etch used to define the S/D regions [1]- [16]. The elimination of the patterning step for the etch-stop implies a corresponding reduction in the manufacturing cost of the resulting display panels.…”
Section: Introductionmentioning
confidence: 98%
“…Figure shows the relationship of the crystallinity of various IGZOs. We have reported in that a CAAC‐IGZO thin film has crystals oriented along the c‐axis and vertically to the film surface.…”
Section: Structure and Fabricationmentioning
confidence: 99%